Solid-state image pickup device and manufacturing method thereof
View Patent ↗There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.
1. An image pick-up device comprising:
a substrate;
a functional region on the substrate;
an organic photoelectric conversion film between two electrodes in the functional region;
a peripheral region on the substrate and surrounding the functional region;
one or more insulating layers between the organic photoelectric conversion film and the substrate;
a bonding pad in the peripheral region;
an aperture in the one or more insulating layers exposing the bonding pad; and
a guard ring that, in plan view, surrounds either the bonding pad or the functional region.
2. The image pickup device of claim 1 , wherein:
the functional region includes two or more image pick-up regions, and
the organic photoelectric conversion film extends continuously over all of the image pick-up regions.
3. The image pick-up device of claim 1 , wherein the organic photoelectric conversion film includes a pigment selected from the group consisting of a rhodamine-based pigment, a melacyanine-based pigment, aquinacridone, a phthalocyanine-based pigment, a coumarine-based pigment, and a tris-8-hydroxyquinoline aluminum (Alq3), melacyanine-based pigment.
4. The image pickup device of claim 1 , wherein the organic photoelectric conversion film includes a pigment selected from the group consisting of a rhodamine-based pigment, a melacyanine-based pigment, aquinacridone, a phthalocyanine-based pigment, a coumarine-based pigment, and a tris-8-hydroxyquinoline aluminum (Alq3), melacyanine-based pigment.
5. The image pickup device according to claim 1 , wherein the guard ring includes a first guard ring that is within a region that surrounds the functional region and that does not include the aperture.
6. The image pickup device according to claim 5 , wherein the guard ring includes:
a second guard ring surrounding the aperture; and
a third guard ring along an outer circumference of a chip.
7. The image pickup device according to claim 6 , wherein the second guard ring extends across a plurality of apertures.
8. The image pickup device according to claim 1 , wherein the guard ring is formed from a material that is not permeable to moisture and oxygen.
9. The image pickup device according to claim 1 , wherein the guard ring has a configuration in which one or more metallic layers are laminated around the functional region.
10. The image pickup device according to claim 9 , wherein each metallic layer is configured of a material selected from the group consisting of aluminum, tungsten, titanium, molybdenum, tantalum, copper, an alloy film of aluminum, tungsten, titanium, molybdenum, tantalum, copper, or a silicon- or oxygen-containing metallic film of aluminum, tungsten, titanium, molybdenum, tantalum, and copper.
11. The image pickup device according to claim 9 , further comprising a passivation film, the passivation film being cladded directly on an uppermost layer configuring the guard ring.
12. The image pickup device according to claim 1 , further comprising:
an insulating film at least around the functional region; and
a groove in the insulating layer,
wherein,
the guard ring is embedded in the groove.
13. The image pickup device according to claim 12 , wherein the embedded guard ring is configured of a metallic film or a silicon nitride film.
14. The image pickup device according to claim 13 , wherein the embedded guard ring is configured of a material selected from the group consisting of aluminum, tungsten, titanium, molybdenum, tantalum, copper, an alloy film of aluminum, tungsten, titanium, molybdenum, tantalum, copper, or a silicon- or oxygen-containing metallic film of aluminum, tungsten, titanium, molybdenum, tantalum, and copper.
15. The image pickup device according to claim 12 , further comprising a passivation film that covers a top surface of the functional region and a top surface of the insulating film, the passivation film being cladded directly on the embedded guard ring.
16. The image pickup device according to claim 1 , further comprising:
an insulating film extending around the functional region; and
a passivation film covering a top surface of the functional region and a top surface of the insulating film,
wherein,
the guard ring is configured of the passivation film cladded at an inside of a groove that is provided in the insulating film.
17. The image pickup device according to claim 11 , wherein the passivation film is configured of a material film that is not permeable to moisture and oxygen therethrough.
18. The image pickup device according to claim 17 , wherein the passivation film is configured of a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film, or a laminated film stacking a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film.
19. The image pickup device according to claim 1 , further comprising:
a charge transmission section inside the substrate; and
a multi-layer wire on an opposite side of a principal surface of the semiconductor substrate and connected with the bonding pad,
wherein,
in operation, the charge transmission section transmits a signal charge that is photoelectrically converted by the organic photoelectric conversion film or a potential corresponding to a signal charge to the bonding pad via the multi-layer wire.