Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus
View Patent ↗A solid-state imaging apparatus includes an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels. The in-layer lens is formed of a coating-type high-refractive-index material. The connection region includes an opening that is formed such that an upper surface of the electrode pad is exposed from the high-refractive-index material applied to the electrode pad.
1. A method of manufacturing a solid-state imaging apparatus including an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels, the method comprising:
forming a refractive-index layer including a refractive-index material in the imaging region and the connection region, wherein the refractive-index material is formed on the electrode pad;
forming the in-layer lens and an opening that exposes an upper surface of the electrode pad in the connection region by etching back the refractive-index material in the imaging region and in the connection region; and
monitoring an emission wavelength caused by the electrode pad being etched by plasma while etching back the refractive-index material formed on the electrode pad.
2. The method of manufacturing a solid-state imaging apparatus according to claim 1 , wherein the refractive-index material on the electrode pad is set to have a thickness smaller than a thickness corresponding to an etching amount in etching back the refractive-index material.