IP Library Granted Patent US 9,502,459
Granted Patent B2
US 9,502,459 · App. 14/313,462 · Granted Nov 22, 2016

Image pickup device, method of manufacturing image pickup device, and electronic apparatus

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Quick Facts
Patent No.
US 9,502,459
App. No.
14/313,462
Granted
Nov 22, 2016
Kind
B2
Abstract

An image pickup device includes: a photodiode provided in a silicon substrate, and configured to generate electric charge corresponding to an amount of received light, by performing photoelectric conversion; and a transfer transistor provided at an epitaxial layer on the silicon substrate, and configured to transfer the electric charge generated in the photodiode, wherein the transfer transistor includes a gate electrode and a channel region, the gate electrode being embedded in the epitaxial layer, and the channel region surrounding the gate electrode, and the channel region has, in a thickness direction, a concentration gradient in which a curvature of a potential gradient is free from a mixture of plus and minus signs.

Claims (25)

1. An image pickup device comprising:

a photodiode provided in a silicon substrate, and configured to generate electric charge corresponding to an amount of received light, by performing photoelectric conversion; and

a transfer transistor provided at an epitaxial layer on the silicon substrate, and configured to transfer the electric charge generated in the photodiode,

wherein the transfer transistor includes a gate electrode and a channel region, the gate electrode being embedded in the epitaxial layer, and the channel region surrounding the gate electrode, and

the channel region has, in a thickness direction, a concentration gradient in which a curvature of a potential gradient is free from a mixture of plus and minus signs.

2. The image pickup device according to claim 1 , wherein the channel region is formed by providing concentration distribution in the thickness direction, in a process of performing In-Situ Dope epitaxial growth.

3. The image pickup device according to claim 2 , wherein the channel region has a a concentration distribution in which a curvature of a concentration gradient in the thickness direction is free from a mixture of plus and minus signs.

4. The image pickup device according to claim 3 , wherein

the channel region is of one conductivity type in the thickness direction, and

the channel region is a single layer.

5. The image pickup device according to claim 4 , wherein

the epitaxial layer includes a trench passing through the epitaxial layer,

the gate electrode is formed to fill the trench, and

the channel region is formed on a side face of the trench and a part in proximity to the side face.

6. The image pickup device according to claim 5 , wherein

the silicon substrate includes an impurity region provided in a part of the silicon substrate, the part being immediately above the photodiode, and the impurity region having a concentration lower than an impurity concentration of the photodiode, and

a base of the trench is in contact with the impurity region.

7. An electronic apparatus comprising:

an image pickup device; and

a signal processing circuit configured to perform predetermined processing on a pixel signal outputted from the image pickup device,

wherein the image pickup device includes

a photodiode provided in a silicon substrate, and configured to generate electric charge corresponding to an amount of received light, by performing photoelectric conversion, and

a transfer transistor provided at an epitaxial layer on the silicon substrate, and configured to transfer the electric charge generated in the photodiode,

the transfer transistor includes a gate electrode and a channel region, the gate electrode being embedded in the epitaxial layer, and the channel region surrounding the gate electrode, and

the channel region has, in a thickness direction, a concentration gradient in which a curvature of a potential gradient is free from a mixture of plus and minus signs.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE INCORRECT APPLICATION NUMBER 14/572221 AND REPLACE IT WITH 14/527221 PREVIOUSLY RECORDED AT REEL: 040815 FRAME: 0649. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 27, 2022
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 058875/0887 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED ON REEL 039635 FRAME 0495. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 5, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040815/0649 →
CHANGE OF NAME Recorded Aug 9, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039635/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2014
From: MIYANAMI, YUKI
To: SONY CORPORATION
Reel/Frame 033224/0926 →