Method for alignment of microwires
A method of aligning microwires includes modifying the microwires so they are more responsive to a magnetic field. The method also includes using a magnetic field so as to magnetically align the microwires. The method can further include capturing the microwires in a solid support structure that retains the longitudinal alignment of the microwires when the magnetic field is not applied to the microwires.
1. A method of forming a device, comprising:
modifying silicon microwires so as to increase the responsivity of the silicon microwires to a magnetic field;
using the magnetic field to longitudinally align the silicon microwires; and
at least partially embedding the aligned silicon microwires in a polymer to maintain longitudinal alignment of the silicon microwires.
2. The method of claim 1 , wherein using the magnetic field includes applying the magnetic field to the microwires such that more than 90% of the microwires each has a longitudinal axis that is within 7° of the direction of the magnetic field.
3. The method of claim 1 , wherein the longitudinal axis of less than 90% of the microwires was within 7° of the direction of the magnetic field before using the magnetic field.
4. The method of claim 1 , wherein modifying the microwires includes forming a coating of a material on a body of the microwire.
5. The method of claim 4 , further comprising:
removing at least a portion of the coating after using the magnetic field.
6. The method of claim 4 , wherein the coating is more than 20 nm thick.
7. The method of claim 4 , wherein coating includes a ferromagnetic material.
8. The method of claim 7 , wherein forming the coating includes electroplating or sputtering the microwires with the ferromagnetic material.
9. The method of claim 8 , wherein the ferromagnetic material includes at least one components selected from nickel and cobalt.
10. The method of claim 1 , further comprising:
placing the microwires in a liquid so as to form an alignment liquid before using the magnetic field.
11. The method of claim 10 , further comprising:
placing the alignment liquid on a substrate before using the magnetic field.
12. The method of claim 11 , further comprising:
making a surface of the substrate hydrophilic before placing the placing the alignment liquid on the surface of the substrate.
13. The method of claim 11 , wherein the electrical field is used such that ends of the aligned microwires are pulled into contact with the surface of the substrate.
14. The method of claim 11 , wherein the alignment liquid is placed on a surface of the substrate such that less than 90% of the microwires was within 7° of the direction of the magnetic field before using the magnetic field.
15. The method of claim 14 , wherein the magnetic field causes the microwires to re-arrange themselves in the alignment liquid such that more than 90% of the microwires have a longitudinal axis that is within 7° of the line that is perpendicular to the surface of the substrate.
16. The method of claim 1 , further comprising:
capturing the longitudinally aligned microwires in a solid support that holds the microwires in a longitudinally aligned configuration when the magnetic field is not applied to the microwires.
17. The method of claim 16 , wherein modifying the microwires includes forming a coating of a material on a body of the microwire, and further comprising:
removing at least a portion of the coating after capturing the longitudinally aligned microwires in the solid support.
18. The method of claim 1 , wherein the microwires have a diameter that is less than 2 μm and an aspect ratio that is greater than 10.