Photosensitive composition, cured film and production process thereof, and electronic part
It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH 2 OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).
1. A photosensitive composition comprising:
a resin (A) having a phenolic hydroxyl group;
a crosslinking agent (B1) having at least two oxazoline groups;
a crosslinking agent (B2) having at least two groups represented by —CH 2 OR, wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group; and
a photosensitive acid-generating agent (C),
wherein a mass ratio of the crosslinking agent (B1) to the crosslinking agent (B2) (B1:B2) is in the range of 1.5:1 to 3:1, and
wherein the crosslinking agent (B2) comprises at least one selected from a melamine-based crosslinking agent, a guanamine-based crosslinking agent, a phenol compound having a methylol group, a phenol compound having an alkylmethylol group and a phenol compound having an acetoxymethyl group.
2. The photosensitive composition according to claim 1 , wherein the total of the contents of the crosslinking agent (B1) and of the crosslinking agent (B2) is 50 to 100% by mass based on 100% by mass of the whole of a crosslinking agen (B) contained in the composition.
3. The photosensitive composition according to claim 1 , wherein the crosslinking agent (B1) has two to three oxazoline groups.
4. The photosensitive composition according to claim 1 , wherein the photosensitive acid-generating agent (C) comprises a compound having a quinone diazide group.
5. A resin composition comprising:
a resin (A) having a phenolic hydroxyl group;
a crosslinking agent (B1) having at least two oxazoline groups; and
a crosslinking agent (B2) having at least two groups represented by —CH 2 OR, wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group,
wherein a mass ratio of the crosslinking agent (B1) to the crosslinking agent (B2) (B1:B2) is in the range of 1.5:1 to 3:1, and
wherein the crosslinking agent (B2) comprises at least one selected from a melamine-based crosslinking agent, a guanamine-based crosslinking agent, a phenol compound having a methylol group, a phenol compound having an alkylmethylol group and a phenol compound having an acetoxymethyl group.
6. A cured film obtained from the photosensitive composition according to claim 1 .
7. A process for producing a patterned cured film comprising:
applying the photosensitive composition according to claim 1 on a support to form a resin coating film;
exposing the resin coating film;
developing the resin coating film by using an alkaline developing solution to form a pattern; and
heat-curing the pattern to form a patterned cured film.
8. A cured film obtained from the resin composition according to claim 5 .
9. A process for producing a cured film comprising:
applying the resin composition according to claim 5 on a support to form a resin coating film; and
heat-curing the resin coating film to form a cured film.
10. An electronic part comprising the cured film according to claim 6 .
11. An electronic part comprising the cured film according to claim 8 .
12. The photosensitive composition according to claim 1 , further comprising an adhesion assistant.
13. The resin composition according to claim 5 , further comprising an adhesion assistant.