Inspecting apparatus and inspecting method

1. An inspecting apparatus, comprising:

a contact position obtaining unit which obtains, by using an inspection result of whether there is a particle on an inspection surface of a holding object and coordinate information of a convex portion in an electrostatic chuck holding mechanism, a contact position of the inspection surface with the convex portion; and

an inspection status determining unit which determines whether a size of the particle adhering to a contact region in contact with the convex portion of the inspection surface is within an allowable range by using a first determining criterion value and determines whether the size of the particle adhering to a non-contact region other than the region in contact with the convex portion of the inspection surface is within an allowable range by using a second determining criterion value larger than the first determining criterion value, wherein

the inspecting apparatus configured to inspect whether there is the particle adhering to a surface on a side in contact with the convex portion of the holding object held by the convex portion of the electrostatic chuck holding mechanism.

2. The inspecting apparatus according to claim 1 , wherein the second determining criterion value is larger than the first determining criterion value by a height of the convex portion.

3. The inspecting apparatus according to claim 1 , wherein

the contact position obtaining unit includes:

an actual contact region determining unit which calculates, by using coordinates of a plurality of positions estimated to be brought into contact with convex portions of the inspection surface selected from inspection images obtained by taking images of the inspection surface, an interval between the plurality of positions and makes the plurality of positions actual contact regions when the interval is an integral multiple of an interval between the convex portions;

a contact region estimating unit which estimates an estimated contact region in contact with the convex portion in the inspection surface by using the coordinates of the actual contact regions and the calculated interval; and

a contact region obtaining unit which obtains contact regions from the actual contact regions and the estimated contact region and makes a region other than the contact regions in the inspection surface the non-contact region.

4. The inspecting apparatus according to claim 3 , wherein the actual contact region determining unit performs calculation by using a least-square method or a Fourier transform in the calculation of the interval.

5. The inspecting apparatus according to claim 1 , wherein

the contact position obtaining unit includes:

an actual contact region determining unit which calculates, by using coordinates of particles in a region in which the particles are regularly arranged in a particle map indicating positions of the particles on the inspection surface, an interval between the particles and makes the positions of the regular particles actual contact regions when the interval is an integral multiple of an interval between convex portions,

a contact region estimating unit which estimates an estimated contact region in contact with the convex portion in the inspection surface by using the coordinates of the particles and the calculated interval; and

a contact region obtaining unit which obtains contact regions from the actual contact regions and the estimated contact region and makes a region other than the contact regions in the inspection surface the non-contact region.

6. The inspecting apparatus according to claim 5 , wherein the actual contact region determining unit performs calculation by using a least-square method or a Fourier transform in the calculation of the interval.

7. The inspecting apparatus according to claim 1 , wherein the inspection result includes a coordinate and a size of the particle on the inspection surface.

8. The inspecting apparatus according to claim 7 , wherein the inspection result further includes an inspection image obtained by taking an image of a position of the particle on the inspection surface.

9. The inspecting apparatus according to claim 1 , wherein the inspection result further includes a composition analysis result of the particle on the inspection surface, and

the inspection status determining unit has a determining criterion value of the contact region and a determining criterion value of the non-contact region according to composition of the particle.

10. The inspecting apparatus according to claim 9 , wherein the inspection status determining unit classifies the composition of the particle into composition of a hard particle and composition of a soft particle, determines, when an object to be determined is the hard particle and adheres to the contact region, whether a size of the particle is within an allowable range as compared with a third determining criterion value, determines, when the hard particle adheres to the non-contact region, whether the size of the particle is within an allowable range as compared with a fourth determining criterion value larger than the third determining criterion value, determines, when the object to be determined is the soft particle and adheres to the contact region, whether the size of the particle is within an allowable range as compared with a fifth determining criterion value larger than the third determining criterion value, and determines, when the soft particle adheres to the non-contact region, whether the size of the particle is within an allowable range as compared with a sixth determining criterion value larger than the fifth determining criterion value.

11. The inspecting apparatus according to claim 1 , wherein the holding object is a mask of a semiconductor exposure apparatus or a wafer to be exposed.

12. The inspecting apparatus according to claim 1 , wherein the holding object is a reflective mask of an EUV exposure apparatus.

13. The inspecting apparatus according to claim 1 , further comprising: an inspecting unit which inspects whether there is the particle on the inspection surface of the holding object, and generates the inspection result.

14. The inspecting apparatus according to claim 13 , wherein the inspecting unit further includes a function to obtain an inspection image obtained by taking an image of a position of the particle on the inspection surface.

15. The inspecting apparatus according to claim 13 , wherein the inspecting unit further includes a function to analyze composition of the particle on the inspection surface.

16. An inspecting method, comprising:

inspecting whether there is a particle on an inspection surface of a holding object;

obtaining, by using an inspection result of the inspection and coordinate information of a convex portion in an electrostatic chuck holding mechanism, a contact position of the inspection surface with the convex portion; and

determining whether a size of the particle adhering to a contact region in contact with the convex portion of the inspection surface is within an allowable range by using a first determining criterion value and determining whether the size of the particle adhering to a non-contact region other than the region in contact with the convex portion of the inspection surface is within an allowable range by using a second determining criterion value larger than the first determining criterion value, wherein

the inspecting method of inspecting whether there is the particle adhering to a surface on a side in contact with the convex portion of the holding object held by the convex portion of the electrostatic chuck holding mechanism.

17. The inspecting method according to claim 16 , wherein the second determining criterion value is larger than the first determining criterion value by a height of the convex portion.

18. The inspecting method according to claim 16 , wherein the obtaining the contact position includes:

calculating, by using coordinates of a plurality of positions estimated to be brought into contact with convex portions of the inspection surface selected from inspection images obtained by taking images of the inspection surface, an interval between the plurality of positions;

making the plurality of positions actual contact regions when the interval is an integral multiple of an interval between convex portions;

estimating an estimated contact region in contact with the convex portion in the inspection surface by using coordinates of the actual contact regions and the calculated interval; and

obtaining contact regions from the actual contact regions and the estimated contact region and making a region other than the contact regions in the inspection surface the non-contact region.

19. The inspecting method according to claim 16 , wherein the obtaining the contact position includes:

calculating, by using coordinates of particles in a region in which the particles are regularly arranged in a particle map indicating positions of the particles on the inspection surface, an interval between the particles;

making positions of the regular particles actual contact regions when the interval is an integral multiple of an interval between convex portions;

estimating an estimated contact region in contact with the convex portion in the inspection surface by using coordinates of the particles and the calculated interval; and

obtaining contact regions from the actual contact regions and the estimated contact region and making a region other than the contact regions in the inspection surface the non-contact region.

20. The inspecting method according to claim 16 , wherein

in the inspecting, composition of the particle on the inspection surface is further analyzed, and

in the determining, an allowable size of the particle is determined by using a determining criterion value of the contact region and a determining criterion value of the non-contact region provided according to the composition of the particle.