IP Library › Granted Patent US 9,621,696
Granted Patent B2
US 9,621,696 · App. 14/167,293 · Granted Apr 11, 2017

Casing and protective shell for mobile electronic device

Inventor: Kuang Hui Hung (Wugu Township, Taipei County, TW)
Assignees: Inventec Appliances (Pudong) Corporation; Inventec Appliances Corp.; Inventec Appliances (Shanghai) Co., Ltd.
H04M1/185A45C11/00H04B1/3888A45C2011/002A45C2011/003G06F2200/1633Y10T428/13
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Quick Facts
Patent No.
US 9,621,696
App. No.
14/167,293
Granted
Apr 11, 2017
Kind
B2
Abstract

The present invention relates to a casing and protective shell for a mobile electronic device. The casing includes an outer layer having a first side exposed to the outside, and a second side opposite to the first side; a flexible buffer layer having a first side connected to the second side of the outer layer, and a second side opposite to the first side of the buffer layer; and a layer for holding, which has a side connected to the second side of the buffer layer.

Claims (20)

1. A casing for a mobile electronic device, comprising:

a first casing part and a second casing part, each of the first casing part and second casing part being movably connected to each other;

the first casing part and the second casing part, comprising:

an outer layer having a first side exposed to the outside, and a second side opposite to the first side;

a flexible buffer layer having a first side connected to the second side of the outer layer, and a second side opposite to the first side of the buffer layer; and

a layer for holding, the holding layer having a side connected to the second side of the buffer layer,

wherein each of the holding layers of the first casing part and the second casing part has a fixing member, and the fixing member of each of the first casing part and second casing part is configured to be inserted through a hole on a circuit board to connect to the fixing member of an opposing casing part of the first casing part and the second casing part, such that the circuit board is firmly held between the first casing part and the second casing part.

2. The casing for the mobile electronic device of claim 1 , wherein each of the outer layer and the holding layer has hardness greater than that of the buffer layer.

3. The casing for the mobile electronic device of claim 1 , wherein the buffer layer of the first casing part and the buffer layer of the second casing part closely fit each other when the first casing part and the second casing part are coupled together.

4. The casing for the mobile electronic device of claim 1 , wherein the buffer layer has an amount of area larger than 80% of the area of the outer layer.

5. A protective shell, applicable for covering a mobile electronic device having a casing, the protective shell comprising:

a first casing part and a second casing part, each of the first casing part and second casing part being movably connected to each other;

the first casing part and the second casing part, comprising:

an outer layer having a first side exposed to the outside, and a second side opposite to the first side;

a flexible buffer layer having a first side connected to the second side of the outer layer, and a second side opposite to the first side of the buffer layer; and

a layer for holding, the holding layer having a first side connected to the second side of the buffer layer, and a second side for covering the casing of the mobile electronic device,

wherein each of the holding layers of the first casing part and the second casing part has a fixing member, and the fixing member of each of the first casing part and second casing part is configured to be inserted through a hole on a circuit board to connect to the fixing member of an opposing casing part of the first casing part and the second casing part, such that the circuit board is firmly held between the first casing part and the second casing part.

6. The protective shell of claim 5 , wherein each of the outer layer and the holding layer has hardness greater than that of the buffer layer.

7. The protective shell of claim 5 , wherein the buffer layer of the first casing part and the buffer layer of the second casing part closely fit each other when the first casing part and the second casing part are coupled together.

8. The protective shell of claim 5 , wherein the buffer layer has an amount of area larger than 80% of the area of the outer layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2026
From: INVENTEC APPLIANCES (PUDONG) CORPORATION; INVENTEC APPLIANCES CORP.; INVENTEC APPLIANCES (SHANGHAI) CO., LTD.
To: INVENTEC APPLIANCES CORP.
Reel/Frame 075776/0806 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2014
From: HUNG, KUANG HUI
To: INVENTEC APPLIANCES (PUDONG) CORPORATION; INVENTEC APPLIANCES CORP.; INVENTEC APPLIANCES (SHANGHAI) CO., LTD.
Reel/Frame 032081/0727 →
Priority Claims (1)
CN 2013 1 0050701 · Feb 7, 2013 · national
Continuity (1)
Related Publication 20140220270A1 · Aug 7, 2014