SYSTEM AND METHOD FOR LED PACKAGING
System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.
1 - 20 . (canceled)
21 . An LED device comprising:
a silicon substrate, the silicon substrate having a first flat surface and a second flat surface, wherein the second flat surface is opposite the first flat surface;
a conductive layer having a first portion and a second portion, wherein the second portion is electrically insulated from the first portion and wherein the first portion and the second portion overly the first flat surface;
a first via structure provided on the first portion;
a second via structure provided on the second portion, the second via structure being electrically insulated from the first via structure; and
a thermal pad structure in thermally-conductive contact with the second flat surface,
wherein the thermal pad structure is electrically insulated from the first portion and the second portion, and
wherein the a portion of the thermal pad structure overly the second flat surface, and cover more than 30% of the second flat surface.
22 . The device of claim 21 , further comprising an LED electrically coupled to the first portion.
23 . The device of claim 21 , wherein the thermal pad structure comprises a reflective surface.
24 . The device of claim 21 , wherein the thermally-conductive contact is characterized by a thermal resistance of less than about 25° C./W.
25 . The device of claim 21 , further comprising a reflective layer overlying at least a portion of the first flat surface, the reflective layer defining an opening for a bond pad.
26 . The device of claim 21 , further comprising an insulation region between the first portion and the second portion, wherein the insulation region comprises titanium oxide.
27 . The device of claim 21 , further comprising an insulation region between the first portion and the second portion, wherein the insulation region comprises silicon oxide.
28 . A light source comprising:
a silicon substrate, the silicon substrate having a first flat surface and a second flat surface;
a conductive layer having a first portion and a second portion, wherein the second portion is electrically insulated from the first portion and wherein the first portion and the second portion are juxtaposed on a plane parallel to the first flat surface;
a first via structure provided on the first portion;
a second via structure provided on the second portion, the second via structure being electrically insulated from the first via structure; and
a thermal pad structure in thermally-conductive contact with the second flat surface,
wherein the thermal pad structure is electrically insulated from the first portion and the second portion, and
wherein a portion of the thermal pad structure overlies the second flat surface, and covers more than 30% of the second flat surface.
29 . The light source of claim 28 , further comprising an LED electrically coupled to the first portion.
30 . The light source of claim 28 , wherein the thermal pad structure comprises a reflective surface.
31 . The light source of claim 28 , wherein the thermally-conductive contact is characterized by a thermal resistance of less than about 25° C./W.
32 . The light source of claim 28 , further comprising a reflective layer overlying at least a portion of the firs flat surface, the reflective layer defining an opening for a bond pad.
33 . The light source of claim 32 , wherein the reflective layer comprises a metal.
34 . The light source of claim 28 , further comprising an insulation region between the first portion and the second portion, wherein the insulation region comprises titanium oxide.
35 . The light source of claim 28 , further comprising an LED package.
36 . The light source of claim 35 , wherein the LED package is a surface mount package.