Method for manufacturing a flexible display device by removing foreign particles
A method for manufacturing a flexible display device includes: manufacturing a flexible substrate on a substrate by: forming a first organic layer on the substrate, removing foreign particles formed on the first organic layer and forming a recessed first repair groove in the first organic layer, forming a first inorganic layer on the first organic layer, forming a second organic layer on the first inorganic layer and forming a second inorganic layer on the second organic layer, forming a display for displaying an image on the flexible substrate and removing the substrate from the first organic layer.
1. A method for manufacturing a flexible display device, comprising:
manufacturing a flexible substrate on a substrate by:
forming a first organic layer on the substrate;
removing foreign particles formed on the first organic layer and forming a recessed first repair groove in the first organic layer;
forming a first inorganic layer on the first organic layer;
forming a second organic layer on the first inorganic layer; and
forming a second inorganic layer on the second organic layer;
forming a display for displaying an image on the flexible substrate; and
removing the substrate from the first organic layer.
2. The method of claim 1 , wherein
the forming of the display is performed by forming an organic light emitting diode on the flexible substrate.
3. The method of claim 1 , wherein
the removing of foreign particles is performed by irradiating laser beams on the first organic layer.
4. The method of claim 1 wherein
the forming of the first organic layer on the substrate is performed by coating an organic material on the substrate, and
the forming of the first inorganic layer on the first organic layer is performed by depositing an inorganic material on the first organic layer.
5. The method of claim 1 , further comprising: filling the first repair groove with a repair material.
6. A method for manufacturing a flexible display device, comprising:
manufacturing a flexible substrate on a substrate by;
forming a first organic layer on the substrate;
forming a first inorganic layer on the first organic layer;
forming a recessed first repair groove in the first organic layer and a first repair hole for exposing the first repair groove in the first inorganic layer by removing foreign particles provided on the first inorganic layer;
forming a second organic layer on the first inorganic layer; and
forming a second inorganic layer on the second organic layer;
forming a display for displaying an image on the flexible substrate; and
removing the substrate from the first organic layer.
7. The method of claim 6 , wherein
the removing of foreign particles is performed by irradiating laser beams on the first inorganic layer.
8. The method of claim 6 , further comprising:
filling the first repair groove with a repair material.
9. A method for manufacturing a flexible display device, comprising:
manufacturing a flexible substrate on a substrate by:
forming a first organic layer on the substrate;
forming a first inorganic layer on the first organic layer;
forming a second organic layer on the first inorganic layer;
forming a second inorganic layer on the second organic layer; and
forming a recessed second repair groove in the second organic layer and a second repair hole for exposing the second repair groove in the second inorganic layer by removing the bubbles formed on the second inorganic layer;
forming a display for displaying an image on the flexible substrate; and
removing the substrate from the first organic layer.
10. The method of claim 9 , wherein
the removing of bubbles is performed by irradiating laser beams on the second inorganic layer.
11. The method of claim 9 , further comprising:
filling the second repair groove with a repair material.
12. A method for manufacturing a flexible display device, comprising:
manufacturing a flexible substrate on a substrate by:
forming a first organic layer on the substrate;
forming a first inorganic layer on the first organic layer;
forming a second organic layer on the first inorganic layer; and
forming a second inorganic layer on the second organic layer;
forming a polysilicon layer on the second inorganic layer;
removing bubbles formed on the polysilicon layer and forming a recessed second repair groove in the second organic layer, a second repair hole for exposing the second repair groove in the second inorganic layer, and a third repair hole for exposing the second repair groove in the polysilicon layer;
forming an active layer by patterning the polysilicon layer;
forming an organic light emitting diode connected to the active layer; and
removing the substrate from the first organic layer.
13. The method of claim 12 , wherein
the removing of bubbles is performed by irradiating laser beams on the polysilicon layer.
14. The method of claim 12 , further comprising:
filling the second repair groove with a repair material.