IP Library Granted Patent US 9,419,214
Granted Patent B2
US 9,419,214 · App. 14/174,917 · Granted Aug 16, 2016

Target, method for producing the same, memory, and method for producing the same

Inventors: Kazuhiro Ohba (Miyagi, JP); Yuichi Kamori (Miyagi, JP); Hitoshi Kimura (Miyagi, JP)
Assignee: SONY CORPORATION
H01L45/08B22F9/04C22C1/05C23C14/14C23C14/3414H01L45/085H01L45/1233H01L45/1266H01L45/145H01L45/146H01L45/1625Y10T428/31678
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Quick Facts
Patent No.
US 9,419,214
App. No.
14/174,917
Granted
Aug 16, 2016
Kind
B2
Abstract

A target including: at least one refractory metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, and lanthanoids; at least one element selected from the group consisting of Al, Ge, Zn, Co, Cu, Ni, Fe, Si, Mg, and Ga; and at least one chalcogen element selected from the group consisting of S, Se, and Te. And a method for producing the target.

Claims (12)

1. A method for producing a target containing a chalcogen element, comprising the steps of:

forming an alloy ingot by combining at least one refractory metal element selected from a first group consisting of Ti, Zr, Hf, V, Nb, Ta, and lanthanoids and an additional element outside of the first group and selected from a second group consisting of Al, Ge, Zn, Co, Cu, Ni, Fe, Si, Mg, and Ga;

pulverizing the alloy ingot; and

forming a target by combining the pulverized alloy ingot and at least one chalcogen element selected from the group consisting of S, Se, and Te.

2. A method for producing a target according to claim 1 , wherein in the step of forming an alloy ingot, a material having a particle diameter of 100 μm or more is used as the at least one refractory metal element that serves as a raw material.

3. A method for producing a target according to claim 1 , further comprising the steps of:

alloying the at least one chalcogen element and at least one additional element that is not a chalcogen element to form a second alloy ingot including the at least one chalcogen element; and

pulverizing the second alloy ingot,

wherein,

the step of forming a target is performed using the pulverized alloy ingot and the pulverized second alloy ingot.

4. A method for producing a target according to claim 3 , wherein the second alloy ingot has a melting point higher than the melting point of the at least one chalcogen element.

5. A method for producing a target according to claim 3 , wherein the second alloy ingot is formed using as the at least one additional element that is not a chalcogen element at least one element selected from the group consisting of Al, Ge, Zn, Co, Cu, Ni, Fe, Si, Mg, and Ga.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2014
From: OHBA, KAZUHIRO; KAMORI, YUICHI; KIMURA, HITOSHI
To: SONY CORPORATION
Reel/Frame 032373/0069 →
Priority Claims (1)
JP 2009-175709 · Jul 28, 2009 · national
Continuity (2)
Division 12838524 · Jul 19, 2010
Related Publication 20140151624A1 · Jun 5, 2014