IP Library Granted Patent US 9,136,253
Granted Patent B2
US 9,136,253 · App. 14/176,431 · Granted Sep 15, 2015

Semiconductor light emitting device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,136,253
App. No.
14/176,431
Granted
Sep 15, 2015
Kind
B2
Abstract

According to one embodiment, a semiconductor light emitting device includes: a conductive layer; a first stacked body; a second stacked body; a first light-transmissive electrode; and a first interconnect electrode. The first stacked body includes a first semiconductor layer and a second semiconductor layer. The second semiconductor layer is provided between the first semiconductor layer and the conductive layer. The first light emitting layer is provided between the first semiconductor layer and the second semiconductor layer. The second stacked body includes a third semiconductor layer, a fourth semiconductor layer, and a second light emitting layer. The fourth semiconductor layer is provided between the third semiconductor layer and the conductive layer. The second light emitting layer is provided between the third semiconductor layer and the fourth semiconductor layer. The first interconnect electrode is provided between the second semiconductor layer and the third semiconductor layer.

Claims (27)

1. A semiconductor light emitting device, comprising:

a conductive layer;

a first stacked body including a first semiconductor layer provided to be separated from the conductive layer in a first direction, a second semiconductor layer provided between the first semiconductor layer and the conductive layer, and a first light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the first light emitting layer emitting a first light;

a second stacked body including a third semiconductor layer provided between the second semiconductor layer and the conductive layer, a fourth semiconductor layer provided between the third semiconductor layer and the conductive layer, and a second light emitting layer provided between the third semiconductor layer and the fourth semiconductor layer, the second light emitting layer emitting a second light;

a first light-transmissive electrode provided between the second semiconductor layer and the third semiconductor layer to have ohmic contacts with the second semiconductor layer and the third semiconductor layer, the first light-transmissive electrode transmitting the first light and the second light;

a first interconnect electrode provided between the second semiconductor layer and the third semiconductor layer to be electrically connected to the first light-transmissive electrode;

a first electrode electrically connected to the first semiconductor layer; and

a second electrode electrically connected to the second semiconductor layer and the third semiconductor layer,

wherein the first light-transmissive electrode has:

a first transmissive region provided between the second semiconductor layer and the third semiconductor layer, and

a second transmissive region arranged with the first transmissive region in a direction perpendicular to the first direction,

wherein the first semiconductor layer is disposed between the first electrode and the first light emitting layer, and

wherein the second transmissive region is disposed between the second electrode and the third semiconductor layer.

2. The device according to claim 1 , wherein the conductive layer has an ohmic contact with the fourth semiconductor layer.

3. The device according to claim 1 , wherein the second electrode is provided to be separated from the conductive layer in the direction perpendicular to the first direction.

4. The device according to claim 1 , wherein at least a portion of the first electrode overlaps the first interconnect electrode in the first direction.

5. The device according to claim 1 , further comprising:

a first through-electrode piercing the conductive layer, the fourth semiconductor layer, and the second light emitting layer in the first direction to be electrically connected to the second semiconductor layer and the third semiconductor layer;

a first insulating layer provided between the first through-electrode and the fourth semiconductor layer and between the first through-electrode and the second light emitting layer;

a second through-electrode piercing the conductive layer, the second stacked body, the first light-transmissive electrode, the second semiconductor layer, and the first light emitting layer in the first direction to be electrically connected to the first semiconductor layer; and

a second insulating layer provided between the second through-electrode and the second stacked body, between the second through-electrode and the first light-transmissive electrode, between the second through-electrode and the second semiconductor layer, and between the second through-electrode and the first light emitting layer.

6. The device according to claim 1 , further comprising:

a third stacked body including a fifth semiconductor layer provided to be separated from the first semiconductor layer in the first direction, a sixth semiconductor layer provided between the fifth semiconductor layer and the first semiconductor layer, and a third light emitting layer provided between the fifth semiconductor layer and the sixth semiconductor layer, the fifth semiconductor layer having a fifth conductivity type, the sixth semiconductor layer having a sixth conductivity type different from the fifth conductivity type;

a second light-transmissive electrode provided between the first semiconductor layer and the sixth semiconductor layer to have ohmic contacts with the first semiconductor layer and the sixth semiconductor layer, the second light-transmissive electrode being configured to transmit the light emitted by the first light emitting layer, the second light emitting layer, and the third light emitting layer; and

a second interconnect electrode provided between the first semiconductor layer and the sixth semiconductor layer, the second interconnect electrode being electrically connected to the second light-transmissive electrode.

7. The device according to claim 6 , wherein at least a portion of the first interconnect electrode overlaps the second interconnect electrode in the first direction.

8. The device according to claim 1 , wherein a peak wavelength of the second light is different from a peak wavelength of the first light.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2014
From: KATSUNO, HIROSHI; SAITO, SHINJI; HASHIMOTO, REI; HWANG, JONGIL; NUNOUE, SHINYA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 032183/0784 →