Test architecture for characterizing interconnects in stacked designs
View Patent ↗The disclosed ring-oscillator-based test architecture comprises a plurality of boundary scan cells coupled to a plurality of interconnects and control circuitry. Each of the plurality of boundary scan cells can be configured to operate as, based on control signals, a conventional boundary scan cell or any bit of an asynchronous counter. The control signals are supplied by the control circuitry.
1. An integrated circuit to be fabricated on a first die, comprising:
a plurality of interconnection elements for communicating with another integrated circuit to be fabricated on a second die, the first die and the second die being stacked with one on top of the other or the first die and the second die being mounted on a same substrate;
a plurality of boundary scan cells coupled to the plurality of interconnection elements, wherein each of the plurality of boundary scan cells can be configured to operate as, based on control signals, a conventional boundary scan cell or any bit of an asynchronous counter; and
control circuitry that supplies the control signals.
2. The integrated circuit recited in claim 1 , wherein the conventional boundary scan cell is an IEEE Standard 1149.1 compliant device.
3. The integrated circuit recited in claim 1 , wherein the plurality of interconnection elements are through-silicon vias.
4. The integrated circuit recited in claim 1 , further comprising:
devices for constructing ring oscillators for pre-bond testing of the plurality of interconnection elements, post-bond testing of the plurality of interconnection elements, or both.
5. The integrated circuit recited in claim 4 , wherein the control circuitry further supplies signals for enabling the ring oscillators.
6. One or more non-transitory processor-readable media storing processor-executable instructions for causing one or more processors to create a design of an integrated circuit to be fabricated on a first die, the integrated circuit comprising:
a plurality of interconnection elements for communicating with another integrated circuit to be fabricated on a second die, the first die and the second die being stacked with one on top of the other or the first die and the second die being mounted on a same substrate;
a plurality of boundary scan cells coupled to the plurality of interconnection elements, wherein each of the plurality of boundary scan cells can be configured to operate as, based on control signals, a conventional boundary scan cell or any bit of an asynchronous counter; and
control circuitry that supplies the control signals.
7. The one or more non-transitory processor-readable media recited in claim 6 , wherein the conventional boundary scan cell is an IEEE Standard 1149.1 compliant device.
8. The one or more non-transitory processor-readable media recited in claim 6 , wherein the plurality of interconnection elements are through-silicon vias.
9. The one or more non-transitory processor-readable media recited in claim 6 , wherein the integrated circuit further comprises:
devices for constructing ring oscillators for pre-bond testing of the plurality of interconnection elements, post-bond testing of the plurality of interconnection elements, or both.
10. The one or more non-transitory processor-readable media recited in claim 9 , wherein the control circuitry further supplies signals for enabling the ring oscillators.