Electronics operation for temperature controlled systems
An apparatus and method of controlling temperatures of a plurality of locations on a structure. A temperature at each of the plurality of locations is identified. A desired temperature for each of the plurality of locations is identified. Processing of a workload by a processor at each of the plurality of locations is controlled to control the temperature at each of the plurality of locations to match the corresponding desired temperature for each of the plurality of locations.
1. A method of controlling temperatures of a plurality of locations on a structure, comprising:
identifying a temperature at each of a plurality of faces of a three-dimensional structure;
identifying a desired temperature for the each of the plurality of faces of the three-dimensional structure; and
controlling processing of a workload by a processor on each of the plurality of faces of the three-dimensional structure to control the temperature at the each of the plurality of faces of the three-dimensional structure to match a corresponding desired temperature for the each of the plurality of faces of the three-dimensional structure.
2. The method of claim 1 , wherein the desired temperature for the each of the plurality of faces of the three-dimensional structure is selected from a range of temperatures and a temperature threshold.
3. The method of claim 1 , wherein:
the temperature at the each of the plurality of faces of the three-dimensional structure is the temperature of a device other than the processor implemented adjacent to each of the plurality of faces of the three-dimensional structure and the desired temperature for the each of the plurality of faces of the three-dimensional structure is the desired temperature for the device other than the processor implemented adjacent to each of the plurality of locations; and
the device other than the processor is selected from an electrical device, an electromechanical device, a micro-electromechanical device, an inertial measurement unit, a software defined radio, and a crystal oscillator.
4. The method of claim 3 , wherein the processor on one of the plurality of faces of the three-dimensional structure comprises a signal processor configured to process a signal associated with the device other than the processor implemented adjacent to the one of the plurality of locations.
5. The method of claim 1 , wherein controlling processing of the workload comprises distributing the workload to the processors on the plurality of faces of the three-dimensional structure by the processor on one of the plurality of faces of the three-dimensional structure.
6. The method of claim 1 , wherein controlling processing of the workload comprises changing processing of a portion of the workload from a first processor on a first one of the plurality of faces of the three-dimensional structure to a second processor on a second one of the plurality of faces of the three-dimensional structure to reduce the temperature at the first one of the plurality of faces of the three-dimensional structure and to increase the temperature at the second one of the plurality of faces of the three-dimensional structure.
7. The method of claim 1 , wherein controlling processing of the workload comprises duplicating at a second processor on a second one of the plurality of faces of the three-dimensional structure processing of a portion of the workload processed by a first processor on a first one of the plurality of faces of the three-dimensional structure to increase the temperature at the second one of the plurality of faces of the three-dimensional structure without reducing the temperature at the first one of the plurality of faces of the three-dimensional structure.
8. The method of claim 1 , wherein the three-dimensional structure is on an aircraft.
9. An apparatus, comprising:
a temperature sensor on each of a plurality of faces on a three-dimensional structure, wherein each temperature sensor is configured to identify a temperature at a corresponding one of the plurality of faces of the three-dimensional structure;
a processor on each of the plurality of faces of the three-dimensional structure;
a controller configured to receive information identifying the temperature at the each of the plurality of faces of the three-dimensional structure from the temperature sensor at the each of the plurality of faces of the three-dimensional structure and to control processing of a workload by the processor on the each of the plurality of faces of the three-dimensional structure to control the temperature at the each of the plurality of faces of the three-dimensional structure to match a desired temperature for the each of the plurality of faces of the three-dimensional structure.
10. The apparatus of claim 9 , wherein the desired temperature for the each of the plurality of faces of the three-dimensional structure is selected from a range of temperatures and a temperature threshold.
11. The apparatus of claim 9 further comprising a device other than the processor implemented adjacent to each of the plurality of faces of the three-dimensional structure, wherein the temperature at the each of the plurality of faces of the three-dimensional structure is the temperature of the device other than the processor implemented adjacent to each of the plurality of faces of the three-dimensional structure and the desired temperature for the each of the plurality of faces of the three-dimensional structure is the desired temperature for the device other than the processor implemented adjacent to each of the plurality of faces of the three-dimensional structure, and wherein the device other than the processor is selected from an electrical device, an electromechanical device, a micro-electromechanical device, an inertial measurement unit, a software defined radio, and a crystal oscillator.
12. The apparatus of claim 11 , wherein the processor on one of the plurality of faces of the three-dimensional structure comprises a signal processor configured to process a signal associated with the device other than the processor implemented adjacent to the one of the plurality of faces of the three-dimensional structure.
13. The apparatus of claim 9 , wherein the controller is implemented in the processor on one of the plurality of faces of the three-dimensional structure.
14. The apparatus of claim 9 , wherein the controller is configured to change processing of a portion of the workload from a first processor on a first one of the plurality of faces of the three-dimensional structure to a second processor on a second one of the plurality of faces of the three-dimensional structure to reduce the temperature at the first one of the plurality of faces of the three-dimensional structure and to increase the temperature at the second one of the plurality of faces of the three-dimensional structure.
15. The apparatus of claim 9 , wherein the controller is configured to duplicate at a second processor on a second one of the plurality of faces of the three-dimensional structure processing of a portion of the workload processed by a first processor on a first one of the plurality of faces of the three-dimensional structure to increase the temperature at the second one of the plurality of faces of the three-dimensional structure without reducing the temperature at the first one of the plurality of faces of the three-dimensional structure.
16. The apparatus of claim 9 , wherein the three-dimensional structure is on an aircraft.
17. A method of controlling a temperature at a location on a structure, comprising:
identifying the temperature of a processor at the location;
identifying a desired temperature for the processor at the location; and
controlling processing of a workload by the processor at the location to increase the temperature of the processor at the location to match the desired temperature for the processor at the location.