Encapsulated phase change cell structures and methods
View Patent ↗Methods and devices associated with phase change cell structures are described herein. In one or more embodiments, a method of forming a phase change cell structure includes forming a substrate protrusion that includes a bottom electrode, forming a phase change material on the substrate protrusion, forming a conductive material on the phase change material, and removing a portion of the conductive material and a portion of the phase change material to form an encapsulated stack structure.
1. A method of forming a resistance variable memory structure, the method comprising:
forming a first resistance variable cell stack on a substrate, wherein the first resistance variable cell stack includes:
a resistance variable material portion that encapsulates a first substrate protrusion; and
a top electrode material formed on the resistance variable material portion;
wherein forming the first resistance variable cell stack includes forming a mask over a portion of the substrate and over a first bottom electrode and removing portions of the substrate not covered by the mask;
forming a second resistance variable cell stack on the substrate, wherein the second resistance variable cell stack includes:
the resistance variable material portion encapsulating a second substrate protrusion; and
the top electrode material formed on the resistance variable material portion; and
isolating the first resistance variable cell stack from the second resistance variable cell stack.
2. The method of claim 1 , including forming the top electrode material such that the top electrode material encapsulates the resistance variable material portion.
3. The method of claim 1 , including etching the resistance variable material portion and the top electrode material to expose the substrate.
4. The method of claim 1 , wherein the method includes forming the first resistance variable cell stack by forming the first bottom electrode in the first substrate protrusion and forming the second resistance variable cell stack by forming the second bottom electrode in the second substrate protrusion.
5. The method of claim 4 , including forming the first resistance variable cell stack on a first metal contact and forming the second resistance variable cell stack on a second metal contact.
6. The method of claim 5 , including forming the first bottom electrode on the first metal contact and forming the second bottom electrode on the second metal contact.
7. A method of forming a resistance variable cell structure, the method comprising:
forming a bottom electrode in a substrate material;
forming a substrate protrusion that includes the bottom electrode by:
forming a mask over a portion of the substrate material and the bottom electrode; and
removing portions of the substrate material not covered by the mask while maintaining encapsulation of a first sidewall and a second sidewall of the bottom electrode with the substrate material;
forming a resistance variable material on the substrate protrusion such that the resistance variable material encapsulates at least a portion of the substrate protrusion with the resistance variable material being formed on a top portion of the substrate protrusion and on a sidewall of the substrate protrusion;
forming a conductive material on the resistance variable material; and
removing a portion of the conductive material and a portion of the resistance variable material to form an encapsulated stack structure.
8. The method of claim 7 , including forming the bottom electrode by forming an opening in the substrate material and depositing a conductor in the opening.
9. The method of claim 7 , including forming the resistance variable material using a non-conformal deposition method.
10. The method of claim 7 , including forming the conductive material using a non-conformal deposition method.
11. The method of claim 7 , wherein forming the substrate protrusion includes photo patterning a substrate and etching the substrate.
12. The method of claim 7 , further including isolating the resistance variable cell structure from an adjacent stack structure.
13. A resistance variable memory cell structure, comprising:
a bottom electrode formed in a substrate protrusion, wherein:
a sidewall of the bottom electrode is encapsulated by the substrate protrusion;
an upper surface of the bottom electrode is unmodified by an etch process; and
a sidewall of the substrate protrusion is modified by the etch process;
a resistance variable material portion encapsulating at least a portion of the substrate protrusion, wherein the resistance variable material portion is formed on a top portion of the substrate protrusion and on the sidewall of the substrate protrusion; and
a top electrode formed on the resistance variable material portion.
14. The memory cell of claim 13 , wherein the sidewall of the substrate protrusion is covered by the resistance variable material portion and a sidewall of the resistance variable material portion is at least partially covered by the top electrode.
15. The memory cell of claim 13 , wherein the top electrode at least partially encapsulates the resistance variable material.
16. The memory cell of claim 13 , wherein the bottom electrode is coupled to a metal contact.
17. The memory cell of claim 16 , wherein the metal contact is coupled to a drain region associated with an access device corresponding to the resistance variable memory cell structure.
18. The memory cell of claim 13 , wherein the bottom electrode is not more than about 50 nanometers (nm) in diameter.
19. The memory cell of claim 13 , wherein the resistance variable cell structure is isolated from adjacent resistance variable cell structures.
20. The memory cell of claim 19 , wherein the sidewall of the substrate protrusion is one of at least two sidewalls of the substrate protrusion.