IP Library › Patent Application 14184433
Patent Application
App. No. 14/184,433

THERMAL MODULE ASSEMBLING STRUCTURE

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Quick Facts
Patent No.
US None
App. No.
14/184,433
Abstract

A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

Claims (9)

1 . A thermal module assembling structure comprising:

a heat dissipation board having a receiving channel formed in the heat dissipation board for a heat pipe to fit through the receiving channel, two sides of upper side of the receiving channel being respectively formed with ribs, the ribs horizontally protruding and extending toward the middle of the receiving channel, each rib having an upper surface and a lower surface, the lower surface facing a surface of the heat pipe, at least one deformed recess being formed on the upper surface of each of the ribs, wherein the lower surfaces of the ribs and the surface of the heat pipe are deformed to correspondingly form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe.

2 . The thermal module assembling structure as claimed in claim 1 , wherein the deformed connection section is substantially normal to an axis of the heat pipe.

3 . The thermal module assembling structure as claimed in claim 2 , wherein the deformed connection section includes a deformed raised portion and a deformed recessed portion, the deformed raised portion being formed on the lower surface of the rib, the deformed recessed portion being formed on the surface of the heat pipe.

4 . The thermal module assembling structure as claimed in claim 3 , wherein the deformed raised portion and the deformed recessed portion are tightly fitted and engaged with each other.

5 . A thermal module assembling structure comprising a heat dissipation board having a receiving channel for receiving therein a heat pipe, two sides of upper side of the receiving channel being respectively formed with two ribs, the ribs horizontally extending for restricting the heat pipe in the receiving channel, the thermal module assembling structure being characterized in that each rib has an upper surface and a lower surface, at least one deformed recess being formed on the upper surface of each of the ribs, wherein the lower surfaces of the ribs and a surface of the heat pipe are deformed to correspondingly form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe, by means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

6 . The thermal module assembling structure as claimed in claim 5 , wherein the heat pipe is defined with a lengthwise direction and the deformed connection section is substantially normal to the lengthwise direction of the heat pipe.

7 . The thermal module assembling structure as claimed in claim 5 , wherein the deformed connection section includes a deformed raised portion and a deformed recessed portion, the deformed raised portion being formed on the lower surface of the rib, the deformed recessed portion being formed on the surface of the heat pipe.

8 . The thermal module assembling structure as claimed in claim 7 , wherein the deformed raised portion and the deformed recessed portion are tightly fitted and engaged with each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2014
From: LIN, SHENG-HUANG; LIN, KUO-SHENG
To: ASIA VITAL COMPONENTS CO., LTD.
Reel/Frame 032248/0740 →