Heterojunction oxide non-volatile memory devices
A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer. The formation of the first metal oxide layer has a Gibbs free energy that is lower than the Gibbs free energy for the formation of the second metal oxide layer.
1. A switching device comprising:
a first memory device characterized by a clock wise current to a voltage hysteresis loop; and
a second memory device coupled to the first memory device, wherein the second memory device switching resistor; wherein the second switching resistor is characterized by a counter clock wise current to the voltage hysteresis loop,
wherein the first memory device comprises: a first metal layer; a first metal oxide layer coupled to the first metal layer; a second metal oxide layer coupled to the first metal oxide layer; and a second metal layer coupled to the second metal oxide layer.
2. The switching device of claim 1 , wherein a Gibbs free energy for the formation of the first metal oxide layer is lower than the Gibbs free energy for the formation of the second metal oxide layer.
3. The switching device of claim 1 , wherein the first metal oxide comprises one of: TiO 2 , Ta 2 O 3 , NiO, WO 3 , or Al 2 O 3 , and the second metal oxide layer comprises Praseodymium Calcium Manganese Oxide (PCMO).
4. The switching device of claim 1 , wherein the first metal oxide comprises a first switchable resistance and the second metal oxide comprises a second switchable resistance.
5. The switching device of claim 1 , wherein the first metal oxide layer is characterized by a first high resistance and a first low resistance and the second metal oxide layer is characterized by a second high resistance and a second low resistance and wherein the first high resistance of the first metal oxide layer is greater than the second high resistance of the second metal oxide layer and the first low resistance of the first metal oxide is substantially similar to the second high resistance of the second metal oxide layer.
6. The switching device of claim 1 , wherein the first memory device is characterized by a first state having a first resistance and a second state having a second resistance and the second memory device is characterized by a third state having a third resistance state and a fourth state having a fourth resistance, and wherein the first resistance is higher than the second resistance and the third resistance is higher than the fourth resistance.
7. The switching device of claim 1 , wherein the clockwise voltage hysteresis loop of the first memory device and the counter-clockwise voltage hysteresis loop of the second memory device are asymmetric in magnitude.
8. The switching device of claim 2 , wherein a metal in the first metal oxide layer is different from a metal in the first metal layer.
9. The switching device of claim 6 , wherein it can be identified whether the first memory device is in the first or the second state by performing a non destructive read.
10. The switching device of claim 6 , wherein it can be identified whether the second memory device is in the third or the fourth state by performing a non destructive read.
11. The switching device of claim 6 , wherein the first resistance is substantially different from the third resistance.
12. The switching device of claim 6 , wherein the second resistance is substantially different from the forth resistance.