Heat sink with configurable grounding
Various heat sink/circuit board combinations are disclosed. In one aspect, an apparatus is provided that includes a heat sink and plural contact pins coupled to the heat sink. Each of the contact pins is operable to selectively contact at least one of plural ground conductors of a circuit board. A given contact pin may be selectively moved relative to the heat sink to contact or not contact one of the ground conductors to provide the capability of controlling a number and location of ground points of the heat sink.
1. An apparatus, comprising:
a heat sink;
plural contact pins coupled to the heat sink;
at least one fastener to secure the heat sink to a circuit board, the circuit board having plural ground conductors; and
whereby each of the contact pins is selectively movable relative to the heat sink independently of the at least one fastener to contact or not contact one of the ground conductors without forcing the heat sink toward the circuit board to control a number and location of ground points of the heat sink.
2. The apparatus of claim 1 , wherein the heat sink comprises plural contact pin holes, each of the contact pin holes for receiving one of the contact pins.
3. The apparatus of claim 1 , wherein each contact pin comprises a cylinder, spring coupled to the cylinder and a piston coupled to the spring.
4. The apparatus of claim 1 , wherein each contact pin comprises a threaded pin.
5. The apparatus of claim 1 , comprising the circuit board including the ground conductors and at least one component, the heat sink being positioned on the circuit board in thermal contact with the at least one component.
6. The apparatus of claim 5 , comprising an electronic device, the circuit board being positioned in the electronic device.
7. A method of thermally managing a component of a circuit board having plural ground conductors, comprising:
placing a heat sink in thermal contact with the component and securing the heat sink to the circuit board with at least one fastener, the heat sink including plural contact pins, each of the contact pins being movable relative to the heat sink to selectively contact at least one of plural ground conductors of the circuit board without forcing the heat sink toward the circuit board; and
selectively moving one or more of the contact pins independently of the at least one fastener to contact or not contact one of the ground conductors to control a number and location of ground points of the heat sink.
8. The method of claim 7 , wherein the heat sink comprises plural contact pin holes, each of the contact pin holes for receiving one of the contact pins, the method comprising moving the one or more of the contact pins relative to one or more of the contact holes.
9. The method of claim 7 , wherein each contact pin comprises a cylinder, spring coupled to the cylinder and a piston coupled to the spring, the method comprises moving the one or more contact pins until the piston of each is spring biased or not against one of the ground conductors.
10. The method of claim 7 , wherein each contact pin comprises a threaded pin, the method comprises twisting the threaded pin to move it.
11. The method of claim 7 , comprising positioning the circuit board and the heat sink in an electronic device and testing the circuit board for electromagnetic compatibility with the electronic device.
12. The method of claim 11 , comprising changing the number and/or location of ground points if the electromagnetic compatibility test fails.
13. A method of manufacturing, comprising:
fabricating a heat sink, the heat sink being operable to engage with at least one fastener to secure the heat sink to a circuit board; and
forming plural holes in the heat sink, at least some of the holes being in a first pattern to match a second pattern of ground conductors of the circuit board, the at least some of the holes for receiving plural contact pins being selectively movable relative to the heat sink independently of the at least one fastener to contact or not contact corresponding of the ground conductors to provide the capability of controlling a number and location of ground points of the heat sink without forcing the heat sink toward the circuit board.
14. The method of claim 13 , comprising placing the contact pins in the at least some of the holes.
15. The method of claim 14 , wherein each contact pin comprises a cylinder, spring coupled to the cylinder and a piston coupled to the spring.
16. The method of claim 14 , wherein each contact pin comprises a threaded pin.
17. The method of claim 14 , comprising positioning the heat sink on the circuit board and in thermal contact with at least one component of the circuit board and moving at least one of the contact pins into contact with one of the ground conductors.
18. The method of claim 17 , comprising positioning the circuit board in an electronic device.
19. The method of claim 18 , comprising changing which of the contact pins contact any of the ground conductors after the circuit board is positioned in the electronic device.
20. The method of claim 18 , testing the circuit board for electromagnetic compatibility with the electronic device.