Apparatus and method of miniaturizing the size of a printed circuit board

1. A printed circuit board, comprising:

at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board;

a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer; and

an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section.

2. The printed circuit board of claim 1 , wherein each of the first layer and the second layer includes a conductive material plated to the printed circuit board.

3. The printed circuit board of claim 2 , wherein the conductive material is copper.

4. The printed circuit board of claim 1 , wherein a diameter of the at least one plated-through hole via is 3 mm.

5. The printed circuit board of claim 1 , further comprising a solder mask applied to a top of the first layer and a solder mask applied to a bottom of the second layer.

6. The printed circuit board of claim 1 , wherein the connection tab is inserted in the open slot and melted solder is applied to the open slot through the at least one plated-through hole via to affix the connection tab to the printed circuit board.

7. The printed circuit board of claim 1 , wherein a diameter of the open slot is 6 mm.

8. The printed circuit board of claim 1 , wherein the connection tab is one of a metal tab, a contact, a ground finger, Electromagnetic Interference (EMI) absorbers or structures, or another interconnect element.

9. The printed circuit board of claim 1 , wherein the core section limits the connection tab insertion depth, provides guidance and prevents misalignments of a connection tab assembly.

10. The printed circuit board of claim 1 , wherein the core section includes a prepeg material.

11. The printed circuit board of claim 1 , wherein each of the first layer and the second layer is a composite of a pre-laminated two layer board.

12. The printed circuit board of claim 1 , wherein the printed circuit board is configured in a radio battery product.

13. A panel, comprising:

at least one row of printed circuit boards; and

a drainage section,

wherein each printed circuit board comprises:

at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board;

a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer; and

an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section, and

wherein the drainage section includes drainage holes adjacent to each plated-through hole via.

14. The panel of claim 13 , wherein plating liquid used to plate a conductive material to the printed circuit board and to plate the at least one plated-through hole via and an adjoining input path exits through the drainage holes, thereby enabling continuous negligible impedance conductivity of an entire passage from an input orifice to an output orifice.

15. The panel of claim 13 , wherein the drainage section is removable.