Cross-point memory and methods for fabrication of same
The disclosed technology relates generally to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same. In one aspect, a memory device of the memory array comprises a substrate and a memory cell stack formed between and electrically connected to first and second conductive lines. The memory cell stack comprises a first memory element over the substrate and a second memory element formed over the first element, wherein one of the first and second memory elements comprises a storage element and the other of the first and second memory elements comprises a selector element. The memory cell stack additionally comprises a first pair of sidewalls opposing each other and a second pair of sidewalls opposing each other and intersecting the first pair of sidewalls. The memory device additionally comprises first protective dielectric insulating materials formed on a lower portion of the first pair of sidewalls and an isolation dielectric formed on the first protective dielectric insulating material and further formed on an upper portion of the first pair of sidewalls.
1. A memory device, comprising:
a semiconductor substrate;
a memory cell stack formed between and electrically connected to first and second conductive lines, the memory cell stack comprising:
a first memory element over the semiconductor substrate,
a second memory element formed over the first memory element,
a first pair of sidewalls associated with the first memory element opposing each other;
a first protective dielectric insulating material formed on a lower portion of the first pair of sidewalls;
a second pair of sidewalls associated with the first memory element opposing each other;
a second protective dielectric insulating material formed on a lower portion of the second pair of sidewalls, the second protective dielectric insulating material intersecting the first protective dielectric insulating material;
wherein one of the first and second memory elements comprises a storage element and the other of the first and second memory elements comprises a selector element, the first memory element being closer to the semiconductor substrate than the second memory element; and
an isolation dielectric formed on the first protective dielectric insulating material and further formed on an upper portion of the first pair of sidewalls.
2. The memory device of claim 1 , wherein the first memory element comprises the selector element and the second memory element comprises the storage element.
3. The memory device of claim 2 , wherein the first protective dielectric insulating material is formed on sidewalls of the selector element while not being formed on sidewalls of the storage element.
4. The memory device of claim 2 , wherein the memory device is a phase change memory device, and wherein the first memory element comprises a first chalcogenide composition and the second memory element comprises a second chalcogenide composition.
5. The memory device of claim 4 , wherein the first chalcogenide composition comprises at least one of As and Se.
6. The memory device of claim 1 , further comprising:
a second isolation dielectric further formed over and covering the second protective dielectric insulating material.
7. The memory device of claim 6 , wherein the second protective dielectric insulating material is formed on the second pair of sidewalls of the first memory element while not formed on sidewalls of the second memory element.
8. A memory device, comprising:
a semiconductor substrate;
a memory cell stack formed on the semiconductor substrate, the memory cell stack comprising:
a first memory element over the semiconductor substrate;
a second memory element formed over and overlapping the first memory element;
a first pair of sidewalls associated with the first memory element opposing each other, the first pair of sidewalls extending in a first direction;
a first protective dielectric insulating material formed on a lower portion of the first pair of sidewalls;
a second pair of sidewalls associated with the first memory element opposing each other;
a second protective dielectric insulating material formed on a lower portion of the second pair of sidewalls, the second protective dielectric insulating material extending in a second direction crossing the first direction associated with the first protective dielectric insulating material;
wherein one of the first and second memory elements comprises a storage element and the other of the first and second memory elements comprises a selector element; and
wherein the first protective dielectric insulating material is absent from sidewalls of the second memory element, the first memory element being closer to the semiconductor substrate than the second memory element.
9. The memory device of claim 8 , further comprising an isolation dielectric formed on the first protective dielectric insulating material and further formed on an upper portion of the first pair of sidewalls.
10. The memory device of claim 8 , wherein the second protective dielectric insulating material is formed on the second pair of sidewalls of the first memory element while not being formed on sidewalls of the second memory element.
11. The memory device of claim 8 , wherein the second protective dielectric insulating material extends in the second direction and does not coterminate with the first memory element terminating in the second direction at the first pair of sidewalls.
12. The memory device of claim 8 , wherein the memory device is a phase change memory device, and wherein the first memory element comprises a first chalcogenide composition and the second memory element comprises a second chalcogenide composition.
13. The memory device of claim 12 , wherein the first chalcogenide composition comprises at least one of As and Se.