IP Library Granted Patent US 9,354,251
Granted Patent B2
US 9,354,251 · App. 14/189,787 · Granted May 31, 2016

Integrated circuit (IC) test socket using Kelvin bridge

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Quick Facts
Patent No.
US 9,354,251
App. No.
14/189,787
Granted
May 31, 2016
Kind
B2
Abstract

An integrated circuit test socket is adapted to use with Kelvin connectors by creating closely spaced connectors and counter-rotating links that are nested to conserve space. The connectors are shaped to make contact with a chip and communicate force and sense signals to a tester, allowing a measure of the chip's actual resistance.

Claims (12)

1. A socket for electrically coupling an integrated circuit (IC) to a board so that a signal may be transmitted thereto, comprising:

a base for receiving the integrated circuit thereon;

an elongate resilient tubular member housed in the base;

a plurality of force mounts disposed on one side of the elongate resilient tubular member for conducting force signals to a test device below, each force mount including a lateral opening cavity;

a plurality of sense mounts disposed on an opposite side of the elongate tubular member for conducing sense signals to a test device below, each sense mount including a lateral opening cavity aligned opposite a respective force mount lateral opening cavity;

a force link cooperating with each force mount to make contact with the integrated circuit, the force link including a rocker arm disposed in the lateral opening cavity of the force mount such that the force link pivots about the force mount at the rocker arm and the lateral opening coupling, each force link biased in a disengaged position by the elongate resilient tubular member;

a sense link cooperating with each sense mount to make contact with the integrated circuit, the sense link including a rocker arm disposed in the lateral opening cavity of the sense mount such that the sense link pivots about the sense mount at the rocker arm and the lateral opening coupling, each sense link biased in a disengaged position by the elongate resilient member;

wherein a downward force on the force link rotates the force link toward the sense mount, and the downward force on the sense link rotates the sense link toward the force mount, and wherein a spacing between the force link and the sense link is maintained at all times so that there is no contact between a force link and a sense link.

2. The socket for electrically coupling an integrated circuit of claim 1 , further comprising a Kelvin connector connected to the force mount and the sense mount.

3. The socket for electrically coupling an integrated circuit of claim 2 , wherein the Kelvin connector communicates the actual resistance of the integrated circuit.

4. The socket for electrically coupling an integrated circuit of claim 1 , wherein the force link includes a side notch to avoid the sense link.

5. The socket for electrically coupling an integrated circuit of claim 1 , wherein the sense link includes a side notch to avoid the force link.

Assignments (6)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
FIRST SUPPLEMENT TO INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Sep 17, 2015
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 036622/0065 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2015
From: TITAN SEMICONDUCTOR TOOL, LLC
To: XCERRA CORPORATION
Reel/Frame 035174/0687 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2014
From: LANDA, VICTOR; TIENGTUM, PONGSAK
To: TITAN SEMICONDUCTOR TOOL, LLC
Reel/Frame 032296/0509 →