Transistor and method of fabricating the same

1. A transistor comprising:

a substrate;

a semiconductor layer provided on the substrate and having one side vertical to the substrate and the other side facing the one side;

a first electrode extending along the substrate and contacting the one side of the semiconductor layer;

a second electrode extending along the substrate and contacting the other side of the semiconductor layer;

a conductive wire disposed on the first electrode and spaced from the second electrode;

a gate electrode provided on the semiconductor layer;

a gate insulating layer disposed between the semiconductor layer and the gate electrode, and

an interlayer insulating layer provided directly on the semiconductor layer and covering the gate electrode, wherein the interlayer insulating layer is not vertically over the one side and the other side of the semiconductor layer,

wherein the semiconductor layer, the first electrode, and the second electrode have a coplanar level surface.

2. The transistor of claim 1 , wherein a bottom surface of the semiconductor layer adjacent to the substrate has the same level as a lowermost surface of the first electrode adjacent to the substrate and a lowermost surface of the second electrode adjacent to the substrate.

3. The transistor of claim 1 , wherein the first electrode is disposed at a position facing the second electrode and has a symmetric form to the second electrode.

4. The transistor of claim 1 , wherein the first electrode comprises the same material as the second electrode.

5. The transistor of claim 1 , wherein the semiconductor layer comprises a source region, a drain region, and a channel region,

wherein one of the source region and the drain region extends from the one side and the other one extends from the other side, and the channel region is disposed between the source region and the drain region.

6. The transistor of claim 1 , further comprising a passivation layer covering the conductive wire, the first electrode, the second electrode, and the gate electrode.

7. The transistor of claim 1 , wherein:

the first electrode has a first side near the interlayer insulating layer;

the conductive wire has a second side near the interlayer insulating layer; and

the first side and the second side are coplanar.

8. The transistor of claim 1 , wherein:

the first electrode includes transparent conductive oxides;

the second electrode includes transparent conductive oxides; and

the conductive wire includes at least one of Al and Cu.

9. A transistor comprising:

a substrate;

a semiconductor layer provided on the substrate and having one side vertical to the substrate and the other side facing the one side;

a first electrode extending along the substrate and contacting the one side of the semiconductor layer;

a second electrode extending along the substrate and contacting the other side of the semiconductor layer;

a conductive wire disposed on the first electrode and spaced from the second electrode;

a gate electrode provided on the semiconductor layer;

a gate insulating layer disposed between the semiconductor layer and the gate electrode, and

an interlayer insulating layer provided on the semiconductor layer and covering the gate electrode,

wherein the semiconductor layer, the first electrode, and the second electrode have a coplanar level surface, and

wherein the first electrode is disposed closer to the interlayer insulating layer than the conductive wire is disposed to the interlayer insulating layer.

10. The transistor of claim 9 , wherein the conductive wire does not contact with the interlayer insulating layer.

11. The transistor of claim 9 , wherein the first electrode and the second electrode contact with the interlayer insulating layer.

12. The transistor of claim 9 , wherein the first electrode and the second electrode do not vertically overlap the gate electrode.

13. The transistor of claim 9 , wherein:

the first electrode includes transparent conductive oxides;

the second electrode includes transparent conductive oxides; and

the conductive wire includes at least one of Al and Cu.