PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE

1 . A method of producing an integrated circuit apparatus, comprising:

providing electronic circuitry within a wafer;

sawing the wafer to produce an integrated circuit apparatus that contains said electronic circuitry and has an edge produced by said sawing; and

providing within the wafer a plurality of conductors connected to said electronic circuitry and positioned to be exposed on said edge by said sawing to make said conductors physically accessible on said edge.

2 . The method of claim 1 , wherein said sawing includes sawing with a laser.

3 . The method of claim 1 , including using physical vapor deposition to provide respective conductive connections between respective ones of said conductors and respective conductive contacts on a package substrate.

4 . The method of claim 1 , wherein said providing conductors includes providing one of said conductors in one metal layer of the integrated circuit apparatus, and providing another of said conductors in another metal layer of the integrated circuit apparatus.

5 . The method of claim 4 , wherein said providing conductors includes providing one of said conductors with a different cross-sectional area than another of said conductors.

6 . The method of claim 1 , wherein said providing conductors includes providing one of said conductors with a different cross-sectional area than another of said conductors.

7 . A method of producing an integrated circuit apparatus, comprising:

providing electronic circuitry and a plurality of conductors connected to said electronic circuitry;

providing a package substrate including a plurality of conductive contacts; and

connecting respective ones of said conductors to respective ones of said contacts by respective vias that are physically attached to the associated conductors and contacts.