Three-dimensional structure in which wiring is provided on its surface

Inventors: Shingo Yoshioka (Osaka, JP); Hiroaki Fujiwara (Nara, JP); Hiromitsu Takashita (Osaka, JP); Tsuyoshi Takeda (Osaka, JP)

Assignee: PANASONIC CORPORATION

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Quick Facts

Patent No.: US 9,070,393
App. No.: 14/196,363
Granted: Jun 30, 2015
Kind: B2

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Abstract

One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Claims (5)

1. A three-dimensional structure in which a wiring is provided on a surface, comprising:

an insulating resin layer that contains a filler comprising at least one element selected from typical non-metal elements and typical metal elements,

wherein a recessed wiring gutter is provided in a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed wiring gutter,

wherein an average particle size of the filler is equal to or less than 1/2 of a width of the recessed wiring gutter and is 0.01 μm to 10 μm.

2. The three-dimensional structure according to claim 1 , wherein at least a part of the recessed wiring gutter has a width of 20 μm or less.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2014

From: YOSHIOKA, SHINGO; FUJIWARA, HIROAKI; TAKASHITA, HIROMITSU; TAKEDA, TSUYOSHI

To: PANASONIC CORPORATION

Reel/Frame 032970/0489 →

Priority Claims (2)

JP 2009-015052 · Jan 27, 2009 · national

JP 2009-253131 · Nov 4, 2009 · national

Continuity (3)

Continuation In Part 13836706 · Mar 15, 2013

Division 13144112

Related Publication 20140183751A1 · Jul 3, 2014