Multilayer thin-film back contact system for flexible photovoltaic devices on polymer substrates
A polymer substrate and back contact structure for a photovoltaic element, and a photovoltaic element include a CIGS photovoltaic structure, a polymer substrate having a device side at which the photovoltaic element can be located and a back side opposite the device side. A layer of dielectric is formed at the back side of the polymer substrate. A metal structure is formed at the device side of the polymer substrate.
1. A method for forming a photovoltaic element, comprising:
disposing a dielectric layer on a back side of a polymer substrate;
disposing a metal structure on a device side of the polymer substrate, the device side being opposite of the back side;
disposing a CIGS photovoltaic structure on the metal structure; and
before the steps of disposing, annealing the polymer substrate.
2. The method of claim 1 , the step of disposing the metal structure comprising:
disposing a first metal layer on the device side of the polymer substrate; and
disposing a second metal layer on the first metal layer, the second metal layer having a different composition than the first metal layer.
3. The method of claim 2 , the second metal layer comprising molybdenum.
4. The method of claim 3 , the first metal layer comprising at least one of aluminum, brass, bronze, and copper.
5. The method of claim 4 , further comprising, before the steps of disposing, plasma cleaning the polymer substrate.
6. The method of claim 4 , the dielectric layer comprising at least one of SiO 2 , Al 2 O 3 , and silicone resin.
7. The method of claim 6 , further comprising disposing an adhesion layer on the back side of the polymer substrate, before the step of disposing the dielectric layer on the back side of the polymer substrate.
8. The method of claim 7 , the adhesion layer comprising at least one of molybdenum, aluminum, chromium, titanium, titanium nitride (TiN), a metal oxide, and a metal nitride.
9. The method of claim 4 , further comprising disposing an adhesion layer on the device side of the polymer substrate, before the step of disposing the metal structure on the device side of the polymer substrate.
10. The method of claim 9 , the adhesion layer comprising at least one of molybdenum, aluminum, chromium, titanium, titanium nitride (TiN), a metal oxide, and a metal nitride.