IP Library Granted Patent US 9,427,829
Granted Patent B2
US 9,427,829 · App. 14/199,179 · Granted Aug 30, 2016

Di- or poly-functional electron deficient olefins coated metal powders for solder paste

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Quick Facts
Patent No.
US 9,427,829
App. No.
14/199,179
Granted
Aug 30, 2016
Kind
B2
Abstract

The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Claims (24)

1. A metal particle having di- or poly-functional electron deficient olefin coated on at least a portion of a surface thereof, wherein the di- or poly-functional electron deficient olefin is embraced by the following structure

wherein R 1 is C 1 -C 40 alkyl, C 2 -C 40 alkenyl, or C 3 -C 40 cycloalkyl group, with hydroxyl or alkoxy functionality and/or ether linkages being optional, and n is 2-4.

2. A metal particle according to claim 1 wherein the di- or poly-functional electron deficient olefin has a ceiling temperature below or equal to a melting point of the metal particle.

3. A metal particle according to claim 1 wherein the di- or poly-functional electron deficient olefin further comprises cyanoacrylate monomers embraced by the following structure:

wherein R 1 is C 1 -C 40 alkyl, C 2 -C 40 alkenyl, or C 3 -C 40 cycloalkyl group, with hydroxyl or alkoxy functionality and/or ether linkages being optional, and n is 1.

4. A metal particle according to claim 1 wherein the cyanoacrylate is selected from the group consisting of 1,5-pentanediol bis-cyanoacrylate, 1,6-hexanediol bis-cyanoacrylate, 1,8-octanediol bis-cyanoacrylate, 1,9-nonanediol bis-cyanoacrylate, 1,10-decanediol bis-cyanoacrylate and 1,12-dodecanediol bis-cyanoacrylate.

5. A metal particle according to claim 1 wherein the metal particle is solder.

6. A metal particle according to claim 1 wherein the metal particle is made from elemental metals.

7. A metal particle according to claim 1 wherein the metal particle is made from an alloy.

8. A metal particle according to claim 1 wherein the metal particle is made from an elemental metal selected from the group consisting of tin, silver, copper, lead, zinc, indium, bismuth, and rare earth metals.

9. A metal particle according to claim 1 wherein the metal particle is made from an alloy selected from the group consisting of tin/silver/copper, tin/bismuth, tin/lead, tin/zinc and tin/indium/bismuth alloys.

10. A metal particle according to claim 1 wherein the polymer coating on the metal particle is less than about 5 μm in thickness.

11. A metal particle according to claim 1 wherein the polymer coating on the metal particle is in the range from about 0.0001 to about 3.0 μm in thickness.

12. A metal particle according to claim 1 wherein the polymer coating on the metal particle is in the range from about from 0.001 to about 1 μm in thickness.

13. A solder paste composition comprising the coated metal particle according to claim 1 .

14. A solder paste composition claim 13 wherein the coated metal particles are present in amount of from about 5 to about 98% by weight with respect to the total component.

15. A method of forming a polymer coated metal particle according to claim 1 which includes the steps of:

a) providing a plurality of metal particles;

b) applying a di- or poly-functional electron deficient olefin to substantially coat at least a portion of the surface of the metal particles; and

c) permitting di- or poly-functional electron deficient olefin to cure as a polymer coating on the metal particles.

16. A method of forming a solder paste composition according to claim 13 which includes the steps of:

a) providing solder powder comprising the coated metal particle;

b) providing solder paste components; and

c) blending the polymer coated solder powder with the solder paste components to form a solder paste.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: HENKEL AG & CO. KGAA
To: HARIMA CHEMICALS GROUP, INC.
Reel/Frame 062467/0399 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2016
From: HENKEL AG & CO. KGAA
To: HENKEL IP & HOLDING GMBH
Reel/Frame 039061/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2014
From: LIU, PUWEI; OLSEN, BLAKE; HO, EDWARD
To: HENKEL CORPORATION
Reel/Frame 033784/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2014
From: BURNS, BARRY N.; HOLLOWAY, MATTHEW J.; KILLORAN, JOHN
To: HENKEL IRELAND LIMITED
Reel/Frame 033784/0560 →
MERGER Recorded Sep 22, 2014
From: HENKEL IRELAND LIMITED
To: HENKEL AG & CO. KGAA
Reel/Frame 033784/0815 →