IP Library › Assignment 035050/0378
Patent Assignment
Reel/Frame 035050/0378

Assignment of Assignor's Interest

Recorded: 2015-02-27 Pages: 16
Assignor
HENKEL US IP LLC
Executed: 2015-02-27
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Properties (30)
Non-Flammable and Non-Combustible Adhesive Bonding Systems Having Adherence to Low Energy Surfaces
Patent: 7,098,279 →
Application: 10/419,250 →
Publication: US 2004/0077783
Anaerobic Curable Compositions
Patent: 8,945,338 →
Application: 13/839,785 →
Publication: US 2014/0262022
Photocurable Adhesive Composition and Use of the Same
Patent: 9,663,685 →
Application: 14/162,288 →
Publication: US 2014/0131306
Method for Bonding Substrates Using a Uv Radiation Curing-Redox Curing Adhesive System
Patent: 9,039,852 →
Application: 14/162,880 →
Publication: US 2014/0138013
Electrically Conductive Structural Adhesive
Patent: 9,493,682 →
Application: 14/170,829 →
Publication: US 2014/0220243
Optical Transparent Dual Core Adhesives Composition
Application: 14/178,466 →
Publication: US 2014/0163130
Low Application Temperature Hot Melt Adhesive
Patent: 9,115,299 →
Application: 14/188,167 →
Publication: US 2014/0171586
Di- or Poly-Functional Electron Deficient Olefins Coated Metal Powders for Solder Paste
Patent: 9,427,829 →
Application: 14/199,179 →
Publication: US 2014/0182746
Adhesive Compositions
Patent: 9,574,118 →
Application: 14/266,971 →
Publication: US 2014/0235758
Electronic Devices Assembled with Thermally Insulating Layers
Patent: 9,209,104 →
Application: 14/267,552 →
Publication: US 2014/0239480
Electronic Devices Assembled with Thermally Insulating Layers
Patent: 9,209,105 →
Application: 14/267,579 →
Publication: US 2014/0239481
Selective Coating of Exposed Copper on Silver-Plated Copper
Application: 14/305,053 →
Publication: US 2014/0295200
Adhesive Composition for Temporarily Bonding Use in Wafer Manufacturing
Patent: 9,714,317 →
Application: 14/309,915 →
Publication: US 2014/0303286
Cyanoacrylate Compositions
Patent: 9,550,883 →
Application: 14/333,952 →
Publication: US 2014/0326407
Thermally Insulating Compositions and Electronic Devices Assembled Therewith
Application: 14/481,144 →
Publication: US 2015/0155220
Grafted Telechelic Polyisobutylenes Possessing Reactive Functionality, Processes for Preparing the Same and Curable Compositions Comprising the Same
Patent: 9,790,309 →
Application: 14/488,824 →
Publication: US 2015/0005453
Submicron Silver Particle Ink Compositions, Process and Applications
Application: 61/866,825 →
Conductive Die Attach Film for Large Die Semiconductor Packages and Compositions Useful for the Preparation Thereof
Application: 61/884,844 →
Compositions Having a Matrix and Encapsulated Phase Change Materials Dispersed Therein, and Electronic Devices Assembled Therewith
Application: 61/918,358 →
Reactive Hot Melt Adhesives with Improved Adhesion
Application: 61/927,306 →
No Lift Pallet Mover
Application: 61/982,069 →
Anaerobic Compositions Containing Blocked Acrylic Acid Compounds
Application: 61/987,201 →
Apparatus and Method for Applying Multi-Component Adhesives Using Jetting Valves
Application: 61/988,937 →
Alkoxysilane-Functionalized Hydrocarbon Compounds, Intermediates Thereof And Methods Of Preparation Thereof
Application: 62/018,046 →
Expandable Coating Compositions and Use Thereof
Application: 62/027,826 →
Cure Accelerators for Anaerobic Curable Compositions
Application: 62/030,932 →
Acrylic Polymers and Their Use in Transdermal Drug Delivery
Application: 62/041,286 →
Cure Accelerators for Anaerobic Curable Compositions
Application: 62/058,201 →
Anaerobic Curable Compositions Containing Blocked Dicarboxylic Acid Compounds
Application: 62/061,389 →
Phenylhydrazine/Anhydride Adducts and Anaerobic Curable Compositions Using Same
Application: 62/067,027 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 26, 2014
From: LIU, JIANPING; MAANDI, ANDRUS
To: HENKEL CORPORATION
Reel/Frame 032298/0594 →
Merger Feb 28, 2014
From: HENKEL IRELAND LIMITED
To: HENKEL AG & CO. KGAA
Reel/Frame 032373/0281 →
Merger Feb 28, 2014
From: LOCTITE (R&D) LIMITED
To: HENKEL IRELAND HOLDING B.V.
Reel/Frame 032320/0503 →
Assignment of Assignor's Interest Feb 28, 2014
From: HENKEL AG & CO. KGAA
To: HENKEL IP & HOLDING GMBH
Reel/Frame 032326/0121 →
Merger Feb 28, 2014
From: HENKEL IRELAND HOLDING B.V.
To: HENKEL IRELAND LIMITED
Reel/Frame 032320/0558 →
Assignment of Assignor's Interest Apr 25, 2014
From: WANG, JAMES
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 032759/0562 →
Assignment of Assignor's Interest Apr 25, 2014
From: LU, DAOQIANG
To: HENKEL CORPORATION
Reel/Frame 032759/0699 →
Assignment of Assignor's Interest Apr 25, 2014
From: LEVANDOSKI, SUSAN L.; WALSH, TIMOTHY P.; BAIL, SAM
To: HENKEL CORPORATION
Reel/Frame 032758/0905 →
Assignment of Assignor's Interest May 1, 2014
From: CHENG, CHIH-MIN; MURRAY, JAMES; SCHUFT, CHARLES
To: HENKEL CORPORATION
Reel/Frame 032798/0891 →
Assignment of Assignor's Interest May 7, 2014
From: NGUYEN, MY NHU; BRANDI, JASON
To: HENKEL CORPORATION
Reel/Frame 032837/0416 →
Assignment of Assignor's Interest May 8, 2014
From: ZHANG, RUI
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 032846/0248 →
Assignment of Assignor's Interest May 8, 2014
From: LU, DAOQIANG
To: HENKEL CORPORATION
Reel/Frame 032846/0303 →
Assignment of Assignor's Interest Jul 23, 2014
From: LI, LING
To: HENKEL CORPORATION
Reel/Frame 033369/0687 →
Address Change Aug 28, 2014
From: HENKEL CORPORATION
To: HENKEL CORPORATION
Reel/Frame 033646/0947 →
Assignment of Assignor's Interest Sep 9, 2014
From: ATTARWALA, SHABBIR
To: HENKEL CORPORATION
Reel/Frame 033697/0971 →
Assignment of Assignor's Interest Sep 9, 2014
From: LI, LEO
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 033698/0032 →
Assignment of Assignor's Interest Sep 10, 2014
From: NGUYEN, MY; BRANDI, JASON
To: HENKEL CORPORATION
Reel/Frame 033707/0477 →
Assignment of Assignor's Interest Sep 22, 2014
From: BURNS, BARRY N.; HOLLOWAY, MATTHEW J.; KILLORAN, JOHN
To: HENKEL IRELAND LIMITED
Reel/Frame 033784/0560 →
Merger Sep 22, 2014
From: HENKEL IRELAND LIMITED
To: HENKEL AG & CO. KGAA
Reel/Frame 033784/0815 →
Assignment of Assignor's Interest Sep 22, 2014
From: LIU, PUWEI; OLSEN, BLAKE; HO, EDWARD
To: HENKEL CORPORATION
Reel/Frame 033784/0402 →
Assignment of Assignor's Interest Sep 22, 2014
From: SRIDHAR, LAXMISHA; SHAH, SMITA; MESSANA, ANDREW D.; JACOBINE, ANTHONY F.
To: HENKEL CORPORATION
Reel/Frame 033784/0904 →
Assignment of Assignor's Interest Sep 25, 2014
From: HU, YUHONG; XENIDOU, MARIA; POLLOCK-DOWNER, ALETHEA; SHARAK, MATTHEW
To: HENKEL CORPORATION
Reel/Frame 033814/0700 →
Corrective Assignment to Correct Incorrect Properties 6620263, 8168743, 8642709, 8632654, 7973158, 12765973, 12766112, 13836858, 12945256, 13785007, 13785477, 13799002, 13840063 and 13770295 Previously Recorded on Reel 032326 Frame 0121. Assignor(S Hereby Confirms the Assignment. Sep 26, 2014
From: HENKEL AG & CO. KGAA
To: HENKEL IP & HOLDING GMBH
Reel/Frame 033860/0888 →
Assignment of Assignor's Interest Sep 29, 2014
From: DREEZEN, GUNTHER
To: HENKEL AG & CO. KGAA
Reel/Frame 033837/0660 →
Assignment of Assignor's Interest Sep 29, 2014
From: XIA, BO; OLDENZIJL, RUDOLF W.; CHEN, JIANPING
To: HENKEL CORPORATION
Reel/Frame 033837/0620 →