Electronic devices assembled with thermally insulating layers
View Patent ↗Provided herein are electronic devices assembled with thermally insulating layers.
1. A consumer electronic article of manufacture comprising:
(A) A housing comprising at least one substrate having an interior surface and an exterior surface;
(B) A layer of thermally insulating elements disposed on at least a portion of the interior surface of the at least one substrate, wherein the thermally insulating elements comprises a gas within a hollow sphere-like vessel; and
(C) At least one semiconductor package comprising an assembly comprising at least one of
I.
a semiconductor chip;
a heat spreader; and
a thermal interface material therebetween, or
II.
a heat spreader;
a heat sink; and
a thermal interface material therebetween.
2. The article of manufacture of claim 1 , wherein the thermally insulating elements are used at a concentration within the range of 25% to 99% by volume in a liquid carrier vehicle.
3. The article of manufacture of claim 1 , wherein the thermally insulating elements are applied to the surface in dispersion or a suspension in a liquid carrier vehicle.
4. The article of manufacture of claim 1 , wherein the thermally insulating elements are applied to the surface in a dispersion or a suspension in a liquid carrier vehicle comprising water.
5. The article of manufacture of claim 1 , wherein the thermally insulating elements are applied to the surface in a dispersion or a suspension in a liquid carrier vehicle comprising polymeric emulsions.
6. The article of manufacture of claim 1 , wherein the thermal interface material comprises a thermally-conductive composition for facilitating the transfer of heat from an electronic component to a heat sink comprising:
(a) 60% to 90% by weight of paraffin;
(b) 0% to 5% by weight of resin; and
(c) 10% to 40% by weight of an electrically-conductive filler.
7. The article of manufacture of claim 6 , wherein the electrically-conductive filler is selected from the group consisting of graphite, diamond, silver, copper and alumina.
8. The article of manufacture of claim 6 , wherein the composition has a melting point of approximately 51° C.
9. The article of manufacture of claim 6 , wherein the composition has a melting point of approximately 60° C.
10. The article of manufacture of claim 1 , wherein the thermal interface material has a thermal impedance (° C. cm 2 /Watt) of less than 0.2.
11. The article of manufacture of claim 1 , further comprising a venting element to disperse generated heat from the semiconductor assembly from the article.
12. The article of manufacture of claim 1 , wherein the housing comprises at least two substrates.
13. The article of manufacture of claim 1 , wherein the housing comprises a plurality of substrates.
14. The article of manufacture of claim 1 , wherein the substrates are dimensioned and disposed to engage one another.
15. The article of manufacture of claim 1 , wherein the layer of thermally insulating elements is disposed on at least a portion of the interior surface of the at least one substrate, the complementary exterior surface of which comes into contact with the end user when in use.
16. The article of manufacture of claim 1 , wherein the gas within the hollow sphere-like vessel comprises air.
17. The article of manufacture of claim 1 , wherein the thermal interface material comprises a phase change material.
18. The article of manufacture of claim 1 , wherein the thermal interface material comprises thermal grease.
19. The article of manufacture of claim 1 , wherein the thermal interface material comprises a curable matrix material; fusible metal solder particles substantially devoid of added lead, comprising an elemental solder powder and optionally a solder alloy; and optionally, a catalyst.
20. The article of manufacture of claim 1 , wherein the article is a notebook personal computer, tablet personal computer or a handheld device.