Patent Assignment
Reel/Frame 033698/0032
Assignment of Assignor's Interest
Recorded: 2014-09-09
Pages: 3
Assignor
LI, LEO
Executed: 2014-07-09
Assignee
HENKEL (CHINA) COMPANY LIMITED
ZHANGHENG ROAD, NO. 928, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Adhesive Composition for Temporarily Bonding Use in Wafer Manufacturing
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2014
From: ATTARWALA, SHABBIR
To: HENKEL CORPORATION
Reel/Frame 033697/0971 →
Assignment of Assignor's Interest
Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest
Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →
Assignment of Assignor's Interest
Apr 1, 2016
From: HENKEL (CHINA) COMPANY LIMITED
To: HENKEL AG & CO. KGAA
Reel/Frame 038167/0508 →