IP Library Assignment 033697/0971
Patent Assignment
Reel/Frame 033697/0971

Assignment of Assignor's Interest

Recorded: 2014-09-09 Pages: 3
Assignor
ATTARWALA, SHABBIR
Executed: 2014-06-22
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Adhesive Composition for Temporarily Bonding Use in Wafer Manufacturing
Patent: 9,714,317 →
Application: 14/309,915 →
Publication: US 2014/0303286
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2014
From: LI, LEO
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 033698/0032 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →
Assignment of Assignor's Interest Apr 1, 2016
From: HENKEL (CHINA) COMPANY LIMITED
To: HENKEL AG & CO. KGAA
Reel/Frame 038167/0508 →