IP Library › Assignment 038167/0508
Patent Assignment
Reel/Frame 038167/0508

Assignment of Assignor's Interest

Recorded: 2016-04-01 Pages: 4
Assignor
HENKEL (CHINA) COMPANY LIMITED
Executed: 2015-01-15
Assignee
HENKEL AG & CO. KGAA
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property (1)
Adhesive Composition for Temporarily Bonding Use in Wafer Manufacturing
Patent: 9,714,317 →
Application: 14/309,915 →
Publication: US 2014/0303286
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2014
From: ATTARWALA, SHABBIR
To: HENKEL CORPORATION
Reel/Frame 033697/0971 →
Assignment of Assignor's Interest Sep 9, 2014
From: LI, LEO
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 033698/0032 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →