Method for bonding substrates using a UV radiation curing-redox curing adhesive system

1. A method for bonding two substrates having a shadow area and a transparent area, comprising:

bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

2. The method according to claim 1 , wherein the reducing component of the redox curing adhesive system is applied on the shadow area of the first substrate, and the liquid optically clear adhesive further containing the oxidizing component of the redox curing adhesive system is applied on the whole area of the second substrate.

3. The method according to claim 1 , wherein while preparing the first substrate, an ink composition incorporated with the reducing component of the redox curing adhesive system is applied on the shadow area, and the liquid optically clear adhesive further containing the oxidizing component of the redox curing adhesive system is applied on the whole area of the second substrate.

4. The method according to claim 1 , wherein the reducing component of the redox curing adhesive system is applied on the shadow area of the first substrate, a shadow adhesive containing the oxidizing component of the redox curing adhesive system is applied on the shadow area of the second substrate, the liquid optically clear adhesive is applied on the transparent area of the second substrate, and a dam adhesive is applied on the second substrate between the shadow adhesive and the liquid optically clear adhesive,

the shadow adhesive is an adhesive either optically clear or opaque,

the dam adhesive is an optically clear adhesive having a viscosity of 20000-60000 cps at 25° C.

5. The method according to claim 1 , wherein the reducing component and the oxidizing component of the redox curing adhesive system are distributed and mixed simultaneously on the shadow area of the second substrate, and the liquid optically clear adhesive is applied on the transparent area of the second substrate, then the first substrate and the second substrate are bonded together.

6. The method according to claim 1 , wherein after coating the redox curing adhesive system and the liquid optically clear adhesive between the first substrate and the second substrate, the method further comprises the following steps:

laminating the above two substrates, and curing the two substrates using UV spot pre-cure;

conducting inspection to see if defects exist between the bonded substrates, and rework if necessary;

curing the liquid optically clear adhesive in the transparent area using UV radiation, and the bonded substrates are left at room temperature for 24 hours for redox curing.

7. The method according to claim 1 , wherein the oxidizing component of the redox curing adhesive system is one or more kinds of peroxides.

8. The method according to claim 1 , wherein the reducing agent in the redox curing adhesive system is selected from one or more of amine, pyridine, aldehyde-amine condensates and thiourea derivatives.

9. The method according to claim 1 , wherein copper acetylacetonate is added to the redox curing adhesive system as a redox curing reaction accelerator.

10. The method according to claim 1 , wherein the UV initiator is 1-hydroxy-cyclohexyl-phenyl ketone or diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide.