IP Library › Assignment 037817/0866
Patent Assignment
Reel/Frame 037817/0866

Assignment of Assignor's Interest

Recorded: 2016-02-24 Pages: 4
Assignor
HENKEL (CHINA) CO. LTD.
Executed: 2014-12-11
Assignee
HENKEL AG & CO. KGAA
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property (1)
Method for Bonding Substrates Using a Uv Radiation Curing-Redox Curing Adhesive System
Patent: 9,039,852 →
Application: 14/162,880 →
Publication: US 2014/0138013
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2014
From: ZHOU, NICOLAS; YUAN, YINXIAO; SONG, CHONGJIAN
To: HENKEL (CHINA) COMPANY LIMITED
Reel/Frame 033961/0263 →
Assignment of Assignor's Interest Oct 16, 2014
From: ATTARWALA, SHABBIR; LU, DAOQIANG
To: HENKEL CORPORATION
Reel/Frame 033961/0377 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →