IP Library Assignment 033961/0263
Patent Assignment
Reel/Frame 033961/0263

Assignment of Assignor's Interest

Recorded: 2014-10-16 Pages: 3
Assignors
ZHOU, NICOLAS
Executed: 2014-06-10
YUAN, YINXIAO
Executed: 2014-05-13
SONG, CHONGJIAN
Executed: 2014-05-28
Assignee
HENKEL (CHINA) COMPANY LIMITED
ZHANGHENG ROAD, NO. 928, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property (1)
Method for Bonding Substrates Using a Uv Radiation Curing-Redox Curing Adhesive System
Patent: 9,039,852 →
Application: 14/162,880 →
Publication: US 2014/0138013
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2014
From: ATTARWALA, SHABBIR; LU, DAOQIANG
To: HENKEL CORPORATION
Reel/Frame 033961/0377 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →
Assignment of Assignor's Interest Feb 24, 2016
From: HENKEL (CHINA) CO. LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 037817/0866 →