THERMALLY INSULATIVE COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED THEREWITH
Provided herein is a thermally insulative composition, which is particularly useful to assemble electronic devices.
1 . A thermally insulative composition comprising:
(a) 20% to 90% by volume of phase change material; and
(b) 10% to 80% by volume of thermally insulating elements.
2 . The composition of claim 1 , wherein the thermally insulating elements are dispersed within the phase change material.
3 . The composition of claim 1 , wherein the thermally insulative elements comprise a hollow sphere-like vessel in which is disposed a gas.
4 . The composition of claim 1 , wherein the thermally insulative elements comprise solid materials having porosity or interstices in which gas is disposed.
5 . The composition of claim 1 , wherein the phase change material comprises a paraffin.
6 . The composition of claim 1 , further comprising a resin.
7 . An electronic article of manufacture comprising:
A housing comprising at least one substrate having an interior surface and an exterior surface;
A layer of the composition of claim 1 laid upon a carrier substrate, which layer is disposed on at least a portion of the interior surface of the at least one substrate of the housing; and
At least one semiconductor package comprising an assembly comprising at least one of
I.
a semiconductor chip;
a heat spreader; and
a thermal interface material therebetween, or
II.
a heat spreader;
a heat sink; and
a thermal interface material therebetween.
8 . The article of manufacture of claim 7 , wherein the carrier substrate is a thermally conductive sheet.
9 . The composition of claim 1 , having a melting point of less than approximately 40° C.
10 . The article of manufacture of claim 7 , wherein the housing comprises at least two substrates.
11 . The article of manufacture of claim 7 , wherein the housing comprises a plurality of substrates.
12 . The article of manufacture of claim 7 , wherein the substrates are dimensioned and disposed to engage one another.
13 . The composition of claim 1 , disposed on at least one substrate,
a portion of the interior surface of the at least one substrate, the complementary exterior surface of which comes into contact with the end user when in use.
14 . The composition of claim 1 , wherein the thermally insulating elements comprise a gas.
15 . The composition of claim 1 , wherein the thermally insulating elements comprise air.
16 . The article of manufacture of claim 7 , wherein the article is a notebook personal computer, tablet personal computer or a handheld device.