IP Library › Patent Application 61884844
Patent Application Provisional
App. No. 61/884,844 · Confirmation No. 2110

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-10-21 APP.FILE.REC Filing Receipt 3 View
2013-09-30 SPEC Specification 27 View
2013-09-30 CLM Claims 12 View
2013-09-30 ABST Abstract 1 View
2013-09-30 TR.PROV Provisional Cover Sheet (SB16) 4 View
2013-09-30 WFEE Fee Worksheet (SB06) 2 View
2013-09-30 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/884,844
Filed
2013-09-30