Patent Assignment
Reel/Frame 033960/0279
Assignment of Assignor's Interest
Recorded: 2014-10-16
Pages: 6
Assignors
ZHU, PUKUN
Executed: 2013-10-11
HOANG, GINA
Executed: 2013-10-11
GUPTA, SHASHI
Executed: 2013-10-11
LAIB, ANDREW
Executed: 2013-10-11
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property
(1)
Conductive Die Attach Film for Large Die Semiconductor Packages and Compositions Useful for the Preparation Thereof
Application:
61/884,844 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 5, 2009
From: LIU, WANSHENG; WANG, AIHUA
To: BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION, ON BEHALF OF THE UNIVERSITY OF NEVADA, RENO
Reel/Frame 023058/0542 →
Assignment of Assignor's Interest
Feb 27, 2015
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 035049/0904 →
Assignment of Assignor's Interest
Feb 27, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035050/0378 →