LAMINATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR FORMING CONDUCTIVE PATTERN
A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate.
1 . A laminate comprising a substrate, a metal layer, and a polymer layer provided between the substrate and the metal layer, wherein a metal of the metal layer being chemically bonded to COO extending from a polymer main chain of the polymer layer between the metal layer and the polymer layer.
2 . The laminate according to claim 1 , wherein the polymer layer is formed of a fluorine-based polymer.
3 . The laminate according to claim 1 , wherein the metal layer is formed of one or more metals among silver, gold, platinum, iron, copper, tin, zinc, lead, aluminum, magnesium, nickel, chromium, and manganese, or an alloy thereof.
4 . The laminate according to claim 1 , wherein the metal layer includes aggregates of metal nanoparticles.
5 . The laminate according to claim 1 , wherein the metal layer is an evaporated layer.
6 . A method for producing a laminate comprising:
performing a treatment for a polymer layer formed on a substrate to have a reactive surface, and
forming a metal layer on the reactive surface so that the polymer layer is chemically bonded to the metal layer.
7 . A method for forming a conductive pattern comprising:
applying UV light to a pattern area of an insulating film formed on a substrate; and
applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, wherein a surface of the metal nanoparticles being protected by an organic molecule layer including an alkylamine, an alkyldiamine, or an amine having another structure.
8 . The method for forming a conductive pattern according to claim 7 , wherein the ink is applied using an application member that holds the ink in a gap or a contact area with the substrate.
9 . The method for forming a conductive pattern according to claim 7 , wherein the ink is applied using a blade.
10 . The method for forming a conductive pattern according to claim 7 , wherein the ink is supplied to the substrate through a slit-like discharge mechanism provided to an application member.
11 . The method for forming a conductive pattern according to claim 7 , wherein the ink is applied using a roll.
12 . The method for forming a conductive pattern according to claim 7 , wherein the insulating film is formed of a fluorine-based resin.
13 . The method for forming a conductive pattern according to claim 7 , wherein the pattern area to which the UV light has been applied has a reactive surface in which radicals have been generated through a photochemical reaction.