Radiation-sensitive resin composition, polymer, compound, and method for producing compound

1. A radiation-sensitive resin composition comprising:

a polymer that comprises a structural unit represented by formula (1-1); and

an acid generator,

wherein:

R 1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group;

R 2 is a hydrogen atom;

R C is an organic group to form a cyclopentene structure or a cyclohexene structure together with the carbon atom bonded to R 2 , with the carbon atom bonded to R 3 , and with the carbon atom bonded to R 4 , wherein the cyclopentene structure or the cyclohexene structure does not comprise —CO— or —CS— between carbon atoms included in the cyclopentene structure or the cyclohexene structure; and

R 3 and R 4 are each independently a hydrogen atom, a monovalent chain hydrocarbon group, a monovalent alicyclic hydrocarbon group, or a monovalent aromatic hydrocarbon group, wherein at least one hydrogen atom of the monovalent chain hydrocarbon group, the monovalent alicyclic hydrocarbon group, or the monovalent aromatic hydrocarbon group represented by R 3 or R 4 is optionally substituted with a fluorine atom, and in a case where R c forms the cyclohexene structure, at least one of R 3 and R 4 is a monovalent chain hydrocarbon group, a monovalent alicyclic hydrocarbon group, or a monovalent aromatic hydrocarbon group; or

R 4 is bonded to R 3 to form an alicyclic structure or an aromatic heterocyclic structure together with the carbon atom bonded to R 3 and with the carbon atom bonded to R 4 ; or

R 3 is a hydrogen atom, a monovalent chain hydrocarbon group, a monovalent alicyclic hydrocarbon group, or a monovalent aromatic hydrocarbon group, wherein at least one hydrogen atom of the monovalent chain hydrocarbon group, the monovalent alicyclic hydrocarbon group, or the monovalent aromatic hydrocarbon group represented by R 3 is optionally substituted with a fluorine atom, and R 4 is bonded to R C to form an alicyclic structure or an aromatic heterocyclic structure together with the carbon atom bonded to R 4 .

2. A resist pattern-forming method comprising:

applying the radiation-sensitive resin composition according to claim 1 to form a resist film on a substrate;

exposing the resist film to ultraviolet rays, deep ultraviolet rays, extreme ultraviolet light, X-rays or charged particle rays;

heating the exposed resist film; and

developing the heated resist film to produce a pattern.

3. The resist pattern-forming method according to claim 2 , wherein the exposed resist film is heated at 90° C. or less.

4. The radiation-sensitive resin composition according to claim 1 , wherein R c forms the cyclopentene structure, and R 3 and R 4 are each independently a hydrogen atom, a monovalent chain hydrocarbon group, or a monovalent alicyclic hydrocarbon group.

5. The radiation-sensitive resin composition according to claim 1 , wherein R c forms the cyclohexene structure, R 3 and R 4 are each independently a hydrogen atom, a monovalent chain hydrocarbon group or a monovalent alicyclic hydrocarbon group, and at least one of R 3 and R 4 is a monovalent chain hydrocarbon group, or a monovalent alicyclic hydrocarbon group.

6. The radiation-sensitive resin composition according to claim 1 , wherein R c forms the cyclopentene structure, and R 3 and R 4 are each independently a hydrogen atom or a monovalent chain hydrocarbon group.

7. The radiation-sensitive resin composition according to claim 1 , wherein R c forms the cyclohexene structure, and R 3 and R 4 are each independently a hydrogen atom or a monovalent chain hydrocarbon group, and at least one of R 3 and R 4 is a monovalent chain hydrocarbon group.

8. The radiation-sensitive resin composition according to claim 1 , wherein the alicyclic structure formed by R 3 and R 4 is an alicyclic hydrocarbon structure or an aliphatic heterocyclic structure.

9. The radiation-sensitive resin composition according to claim 1 , wherein the aromatic heterocyclic structure formed by R 3 and R 4 is a thiophene structure or a furan structure.

10. The radiation-sensitive resin composition according to claim 1 , wherein the alicyclic structure formed by R 4 and R C is a cyclopentane structure or a cyclohexane structure.

11. The radiation-sensitive resin composition according to claim 1 , wherein a content of the structural unit represented by formula (1-1) in the polymer is from 10 to 80 mol % based on total structural units included in the polymer.

12. The radiation-sensitive resin composition according to claim 1 , wherein a content of the structural unit represented by formula (1-1) in the polymer is from 20 to 70 mol % based on total structural units included in the polymer.

13. The radiation-sensitive resin composition according to claim 1 , wherein a content of the structural unit represented by formula (1-1) in the polymer is from 30 to 60 mol % based on total structural units included in the polymer.

14. The radiation-sensitive resin composition according to claim 1 , wherein the polymer further comprises at least one structural unit selected from the group consisting of a structural unit that comprises a lactone structure and a structural unit that comprises a cyclic carbonate structure.

15. The radiation-sensitive resin composition according to claim 1 , wherein the polymer further comprises a structural unit that comprises a fluorine atom.

16. The radiation-sensitive resin composition according to claim 1 , wherein the structural unit represented by formula (1-1) comprises a fluorine atom.

17. The radiation-sensitive resin composition according to claim 1 , further comprising a solvent.