Method for manufacturing semiconductor device
A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.
1. A method for manufacturing a semiconductor device comprising:
forming a first oxide semiconductor layer over a substrate;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
forming a third oxide semiconductor layer over the second oxide semiconductor layer; and
performing heat treatment on the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer in an atmosphere containing oxygen.
2. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed by a sputtering method.
3. The method for manufacturing a semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises a crystal structure in which a c-axis is substantially perpendicular to a surface of the second oxide semiconductor layer.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed while heating the substrate.
5. The method for manufacturing a semiconductor device according to claim 1 , wherein the heat treatment is performed at higher than or equal to 100° C. and lower than or equal to 500° C.
6. The method for manufacturing a semiconductor device according to claim 1 , further comprising a step of forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer, wherein each of the source electrode and the drain electrode comprises copper.
7. A method for manufacturing a semiconductor device comprising:
forming a first oxide semiconductor layer over a substrate;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
forming a third oxide semiconductor layer over the second oxide semiconductor layer;
performing first heat treatment on the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer in an atmosphere containing oxygen;
forming an insulating film over and in contact with the third oxide semiconductor layer; and
performing second heat treatment after the step of forming the insulating film.
8. The method for manufacturing a semiconductor device according to claim 7 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed by a sputtering method.
9. The method for manufacturing a semiconductor device according to claim 7 , wherein the second oxide semiconductor layer comprises a crystal structure in which a c-axis is substantially perpendicular to a surface of the second oxide semiconductor layer.
10. The method for manufacturing a semiconductor device according to claim 7 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed while heating the substrate.
11. The method for manufacturing a semiconductor device according to claim 7 , wherein the first heat treatment is performed at higher than or equal to 100° C. and lower than or equal to 500° C.
12. The method for manufacturing a semiconductor device according to claim 7 , further comprising a step of forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer, wherein each of the source electrode and the drain electrode comprises copper.
13. A method for manufacturing a semiconductor device comprising:
forming a first oxide semiconductor layer over a substrate;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
forming a third oxide semiconductor layer over the second oxide semiconductor layer;
etching the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer to form island-shaped oxide semiconductor layers; and
performing heat treatment on the island-shaped oxide semiconductor layers in an atmosphere containing oxygen.
14. The method for manufacturing a semiconductor device according to claim 13 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed by a sputtering method.
15. The method for manufacturing a semiconductor device according to claim 13 , wherein the second oxide semiconductor layer comprises a crystal structure in which a c-axis is substantially perpendicular to a surface of the second oxide semiconductor layer.
16. The method for manufacturing a semiconductor device according to claim 13 , wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer is formed while heating the substrate.
17. The method for manufacturing a semiconductor device according to claim 13 , wherein the heat treatment is performed at higher than or equal to 100° C. and lower than or equal to 500° C.
18. The method for manufacturing a semiconductor device according to claim 13 , further comprising a step of forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer,
wherein each of the source electrode and the drain electrode comprises copper.