Organic light-emitting diode display and manufacturing method thereof
An organic light-emitting diode (OLED) display and a manufacturing method thereof are disclosed. One inventive aspect includes a first substrate, a second substrate, and a first insulation layer, a metal layer and a second insulation layer formed on the first insulation layer. The metal layer is formed on the first insulating layer and has a first through hole. The second insulation layer is formed on the metal layer and has a second through hole. The inventive aspect further includes a sealing member formed by filling the first and second through hole so as to seal the first substrate to the second substrate.
1. An organic light-emitting diode (OLED) display comprising:
a first substrate including a display area and a peripheral area;
a second substrate facing the first substrate;
a sealing member configured to adhere the first substrate to the second substrate; and
a first insulation layer, a metal layer and a second insulation layer formed on the first substrate,
wherein the metal layer is formed on the first insulation layer and has at least a first through hole in the peripheral area,
wherein the second insulation layer is formed on the metal layer and has at least one second through hole that is concentric with the first through hole,
wherein the second through hole has a diameter less than that of the first through hole, and
wherein the sealing member fills each of the first and second through holes.
2. The OLED display of claim 1 , wherein the metal layer contacts the sealing member.
3. The OLED display of claim 1 , wherein a third through hole is defined in the first insulation layer and overlaps the first through hole, and wherein the third through hole has a diameter less than that of the first through hole.
4. The OLED display of claim 3 , wherein the second and third through holes have the same diameter.
5. The OLED display of claim 1 further comprising
a buffer layer, a gate insulation layer and an interlayer dielectric are formed in the display area,
wherein the first insulation layer is formed of the same material as at least one of the buffer layer and the gate insulation layer, and
wherein the second insulation layer is formed of the same material as the interlayer dielectric.
6. The OLED display of claim 1 , further comprising a transistor formed in the display area, wherein the transistor includes a gate electrode, and wherein the metal layer is formed of the same material as the gate electrode.
7. The OLED display of claim 6 , wherein the metal layer and the gate electrode are formed on the same layer.
8. The OLED display of claim 1 , wherein the sealing member has a maximum width of about 750 μm or less.
9. The OLED display of claim 1 , wherein the first through hole has a radius greater by about 3 μm or more than that of the second through hole.
10. The OLED display of claim 1 , further comprising a gold (Au) layer contacting a side surface of the sealing member.
11. The OLED display of claim 10 , wherein the Au layer comprises at least one of a first Au layer contacting the inside of the sealing member and a second Au layer contacting the outside of the sealing member.
12. The OLED display of claim 1 , wherein the sealing member further comprises a plurality of sealing branches surrounding the display area, wherein one end of each of the sealing branches adheres to the first substrate and the second substrate.
13. The OLED display of claim 12 , wherein the other end is exposed to the environment.
14. The OLED display of claim 12 , wherein the sealing branches are spaced apart from each other.
15. The OLED display of claim 12 , further comprising a reinforcing material to reinforce the adhesion between the first and second substrates, wherein the reinforcing material fills the space between two adjacent sealing branches.
16. The OLED display of claim 15 , wherein the reinforcing material is formed of a polymer resin.
17. The OLED display of claim 12 , wherein at least one of the sealing branches perpendicularly contacts the sealing member.
18. A method of manufacturing an organic light-emitting diode (OLED) display, the method comprising:
forming a first substrate having a display area and a peripheral area surrounding the display area;
forming a first insulation layer on the peripheral area of the first substrate;
forming a metal layer on the first insulation layer;
forming a second insulation layer on the metal layer;
forming a first through hole through the first insulation layer, the metal layer and the second insulation layer;
forming a second through hole having a diameter less than that of the first through hole in the metal layer; and
filling the first and second through holes with a sealing material so as to seal the first substrate to a second substrate.
19. The method of claim 18 , wherein the first through hole is formed through a dry etch process.
20. The method of claim 18 , wherein the second through hole is formed through a wet etch process.