Multi-functional hybrid devices/structures using 3D printing
A bioelectronic device and method of making is disclosed. The device includes a scaffold formed via 3D printing. The device also includes a biologic and an electronic device formed via 3D printing, the biologic and electronic device being interweaved with or coupled to the scaffold. The electronic component may e.g., include at least one of hard conductors, soft conductors, insulators and semiconductors. The scaffold may be formed of at least one of synthetic polymers and natural biological polymers. The biologic may include at least one of animal cells, plant cells, cellular organelles, proteins and DNA (including RNA).
1. A bioelectronic device comprising:
a scaffold formed via 3D printing; and
a bioelectronic component formed via 3D printing and comprising:
a cell-seeded matrix interwoven with the scaffold;
an insulating material; and
a conducting material.
2. The device of claim 1 wherein the scaffold is formed of at least one of synthetic polymers and natural biological polymers.
3. The device of claim 1 wherein the bioelectronic component comprises at least one of animal cells, plant cells, cellular organelles, proteins, DNA or RNA.
4. The device of claim 1 wherein the bioelectronic component is formed of laser curable materials.
5. The device of claim 1 wherein bioelectronic component is formed from a polymer.
6. The device of claim 1 wherein the bioelectronic component is formed from nano or micro-scale integrated electronic components.
7. The device of claim 1 wherein the scaffold is generally formed into the shape of an external animal anatomical feature.
8. The device of claim 1 wherein the scaffold is generally formed into the shape of internal animal or plant anatomical conduit.
9. The device of claim 1 wherein the scaffold is generally formed into the shape of plant structure.
10. The device of claim 1 wherein the bioelectronic component has electronic material properties that are modulated during printing via Peltier-based stage heating.
11. The device of claim 1 wherein the scaffold has structural and geometric features that are reduced to micron-scale via application of resistive heating of material syringes and extrusion tips.
12. The device of claim 1 the scaffold is cured via heat or light.
13. The device of claim 1 wherein the bioelectronic component comprises a semiconductor device.
14. The device of claim 13 wherein the semiconductor device is a light emitting diode.
15. The device of claim 1 wherein the bioelectronic device comprises a light harvesting structure formed via 3D printing.
16. The device of claim 1 wherein the bioelectronic device includes hydrogel-based conductive elements arranged into active capacitive components.
17. The device of claim 1 wherein the bioelectronic device include a piezoelectric element, (e.g, actuators, sensors, and printed robotics).
18. A method of forming a bioelectronic device, the method comprising:
forming a scaffold via 3D printing;
forming a bioelectronic component via 3D printing by printing:
a cell-seeded matrix interwoven with the scaffold;
an insulating material; and
a conducting material.
19. A method of forming a bioelectronic device, the method comprising the steps of:
providing a first component comprising a biological material;
providing a second component comprising a conductive or semiconductive material;
generating a bioelectronic construct by depositing at least the first component and the second component in one or more patterns defined by a predetermined print path.
20. The method of claim 19 , further comprising the steps of:
providing a third component comprising a biocompatible material adapted for supporting the bioelectronic device;
depositing the third component in one or more patterns defined by a predetermined print path; and
immersing the construct in a culture media.
21. The method of claim 20 , further comprising the steps of:
providing at least one additional component; and
depositing the at least one component in one or more patterns defined by a predetermined print path.