Reduced stress TSV and interposer structures
View Patent ↗A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
1. A structure comprising a microelectronic component comprising circuitry, the microelectronic component comprising a substrate comprising an opening in a top surface;
wherein the circuitry comprises a conductive via in the opening;
wherein the opening comprises a first sidewall of a first material, and the conductive via comprises a second sidewall of a second material;
wherein at least at one side of the opening, the first and second sidewalls are spaced from each other at the top surface of the substrate but the first and second sidewalls meet below the top surface of the substrate at a meeting location, and between the meeting location and the top surface of the substrate the first and second sidewalls are separated by a third material which is a dielectric different from the first material.
2. The structure of claim 1 wherein at least at said side of the opening, the third material fills an entire space between the meeting location and the top surface of the substrate.
3. The structure of claim 1 wherein the microelectronic component further comprises a conductive barrier layer contacting the conductive via between the meeting location and the top surface of the substrate.
4. The structure of claim 1 wherein the third material provides a lower stress in case of thermal expansion than if the third material were replaced with the second material.
5. The structure of claim 1 wherein the third material comprises foam.
6. The structure of claim 1 wherein the third material comprises a polymer.
7. The structure of claim 1 wherein the first material is semiconductor.
8. The structure of claim 1 wherein the first material is dielectric.
9. The structure of claim 1 wherein the substrate is a semiconductor material.
10. The structure of claim 1 wherein the conductive via is metal.
11. The structure of claim 1 wherein the conductive via passes through the substrate.
12. The structure of claim 11 wherein the microelectronic component includes a conductive post overlying the conductive via and electrically connected to the conductive via.
13. A structure comprising a microelectronic component comprising circuitry, the microelectronic component comprising a substrate comprising an opening in a top surface;
wherein the circuitry comprises a conductive via in the opening;
wherein the opening comprises a first layer separating the conductive via from the substrate at least at one side of the opening, the first layer comprising at least one of a dielectric layer and a barrier layer;
wherein the first layer comprises a first sidewall, and the substrate comprises a second sidewall in the opening;
wherein at least at one side of the opening, the first and second sidewalls are spaced from each other at the top surface of the substrate but the first and second sidewalls meet below the top surface of the substrate at a meeting location, and between the meeting location and the top surface of the substrate the first and second sidewalls are separated by a second layer having a lower Young's modulus than the first layer.
14. The structure of claim 13 wherein the first and second layers are dielectric layers.
15. The structure of claim 13 wherein the first layer comprises a third sidewall, and the conductive via comprises a fourth sidewall;
wherein at least at said side of the opening, the third and fourth sidewalls are separated from each other at the top surface of the substrate but the third and fourth sidewalls meet below the top surface of the substrate.