IP Library Granted Patent US 10,772,522
Granted Patent B2
US 10,772,522 · App. 14/205,150 · Granted Sep 15, 2020

Disposable biometric patch device

Inventor: Stephen Zadig (Portola Valley, CA)
Assignee: VITAL CONNECT, INC.
A61B5/04085A61B5/02438A61B5/0404A61B5/6833A61B5/0002A61B5/01A61B5/0205A61B5/08A61B5/0826A61B5/1117A61B5/4815A61B5/4818A61B2560/0285A61B2560/045A61B2562/0219
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,772,522
App. No.
14/205,150
Granted
Sep 15, 2020
Kind
B2
Abstract

A system and method for health monitoring are disclosed. The system includes a patch device and an electronic module coupled to the patch device. The method includes providing a patch device, coupling an electronic module to the patch device to provide a wearable device, and monitoring health of a user using the wearable device.

Claims (71)

1. A system for health monitoring, the system comprising:

a patch device; and

an electronic module removably coupled to the patch device;

wherein the patch device further comprises:

a top layer;

a sub-assembly layer coupled to the top layer, wherein the sub-assembly layer comprises an electronic flex circuit, and wherein the electronic flex circuit includes at least two electrodes, a battery, and integrated connector circuits for attachment of the electronic module; and

a bottom layer coupled to the sub-assembly layer, and

wherein the patch device includes a sealable flap including an adhesive die cut layer and a foam layer, and

a flap layer between the electronic module and the sealable flap, wherein the flap layer is part of the patch device and prevents the adhesive die cut layer from sticking to the electronic module while allowing for a seal along outer edges of the sealable flap.

2. The system of claim 1 , wherein the patch device is disposable and the electronic module is reusable.

3. The system of claim 1 , wherein the top layer comprises a first layer with two circular areas on opposite ends of the first layer and a chamber area that resides on top of the first layer to house the electronic module.

4. The system of claim 1 , wherein the top layer comprises any of: closed cell foam, polyethylene foam, or a combination thereof, further wherein the top layer is coated with an anti-static material.

5. The system of claim 1 , further comprising:

a first intermediate layer that is coupled between the top layer and the sub-assembly layer.

6. The system of claim 5 , wherein the first intermediate layer comprises a disk layer, an adhesive disk layer coupled to the disk layer, and an adhesive intermediate layer to create a waterproof bond for the patch device.

7. The system of claim 5 , further comprising:

a second intermediate layer that is coupled between the sub-assembly layer and the bottom layer.

8. The system of claim 7 , wherein the second intermediate layer comprises the adhesive die cut layer and the foam layer coupled to the adhesive die cut layer to create a waterproof seal over the sub-assembly layer.

9. The system of claim 8 , wherein the foam layer comprises any of: closed cell foam, polyethylene foam, or a combination thereof.

10. The system of claim 8 , wherein both the adhesive die cut layer and the foam layer include two circular holes.

11. The system of claim 10 , wherein the bottom layer comprises an adhesive bottom layer and a release liner coupled to the adhesive bottom layer.

12. The system of claim 11 , wherein the adhesive bottom layer includes both the sealable flap and the two circular holes, further wherein the release liner only includes the sealable flap.

13. The system of claim 11 , wherein the adhesive bottom layer comprises a plurality of stacked adhesive layers that are each separately removable via a corresponding tab integrated into each of the plurality of stacked adhesive layers.

14. The system of claim 1 , further comprising:

at least two electrode gels that are coupled to the at least two electrodes of the sub-assembly layer via two circular holes.

15. The system of claim 14 , further comprising:

a plurality of notches cut into the patch device to enhance adherence and conformance.

16. A system for health monitoring, the system comprising:

a patch device; and

an electronic module coupled to the patch device,

wherein the patch device further comprises:

a top layer;

a sub-assembly layer coupled to the top layer, wherein the sub-assembly layer comprises an electronic flex circuit, and wherein the electronic flex circuit includes at least two electrodes, a battery, and integrated connector circuits for attachment of the electronic module;

a first intermediate layer that is coupled to the top layer and the sub-assembly layer to form a housing for the electronic module, wherein the first intermediate layer comprises a disk layer, an adhesive disk layer coupled to the disk layer, and an adhesive intermediate layer to create a waterproof bond for the disposable patch device, wherein the disk layer comprises a breathable membrane, wherein the breathable membrane allows diffusion of oxygen but keeps water from penetrating the disposable patch device to a certain depth and for a certain duration; and

a bottom layer coupled to the sub-assembly layer.

17. The system of claim 16 , wherein the patch device is disposable and the electronic module is reusable.

18. The system of claim 16 , wherein the top layer comprises a first layer with two circular areas on opposite ends of the first layer and a chamber area that resides on top of the first layer to house the electronic module.

19. The system of claim 16 , wherein the top layer comprises any of: closed cell foam, polyethylene foam, or a combination thereof, further wherein the top layer is coated with an anti-static material.

20. The system of claim 16 , further comprising:

a second intermediate layer that is coupled between the sub-assembly layer and the bottom layer.

21. The system of claim 20 , wherein the second intermediate layer comprises an adhesive die cut layer and a foam layer coupled to the adhesive die cut layer to create a waterproof seal over the sub-assembly layer.

22. The system of claim 21 , wherein the foam layer comprises any of: closed cell foam, polyethylene foam, or a combination thereof.

23. The system of claim 21 , wherein both the adhesive die cut layer and the foam layer include a sealable flap and two circular holes.

24. The system of claim 23 , further comprising:

a flap layer coupled to the sealable flap of the adhesive die cut layer to prevent the adhesive die cut layer from sticking to the electronic module.

25. The system of claim 23 , wherein the bottom layer comprises an adhesive bottom layer and a release liner coupled to the adhesive bottom layer.

26. The system of claim 25 , wherein the adhesive bottom layer includes both the sealable flap and the two circular holes, further wherein the release liner only includes the sealable flap.

27. The system of claim 25 , wherein the adhesive bottom layer comprises a plurality of stacked adhesive layers that are each separately removed via a corresponding tab.

28. The system of claim 16 , further comprising:

at least two electrode gels that are coupled to the at least two electrodes of the sub-assembly layer via two circular holes.

29. The system of claim 28 , further comprising:

a plurality of notches cut into the patch device to enhance adherence and conformance.

30. A method for health monitoring, the method comprising:

providing a system comprising:

a patch device; and

an electronic module removably coupled to the patch device to provide a wearable device,

wherein the patch device further comprises:

a top layer;

a sub-assembly layer coupled to the top layer, wherein the sub-assembly layer comprises an electronic flex circuit, and wherein the electronic flex circuit includes at least two electrodes, a battery, and integrated connector circuits for attachment of the electronic module; and

a bottom layer coupled to the sub-assembly layer, and

wherein the patch device includes a sealable flap including an adhesive die cut layer and a foam layer, and

a flap layer between the electronic module and the sealable flap, wherein the flap layer is part of the patch device and prevents the adhesive die cut layer from sticking to the electronic module while allowing for a seal along outer edges of the sealable flap; and

monitoring health of a user using the wearable device.

31. A method for health monitoring, the method comprising:

providing a system comprising:

a patch device; and

an electronic module coupled to the patch device to provide a wearable device, wherein the patch device further comprises:

a top layer;

a sub-assembly layer coupled to the top layer, wherein the sub-assembly layer comprises an electronic flex circuit, and wherein the electronic flex circuit includes at least two electrodes, a battery, and integrated connector circuits for attachment of the electronic module;

a first intermediate layer that is coupled to the top layer and the sub-assembly layer to form a housing for the electronic module, wherein the first intermediate layer comprises a disk layer, an adhesive disk layer coupled to the disk layer, and an adhesive intermediate layer to create a waterproof bond for the disposable patch device, wherein the disk layer comprises a breathable membrane, wherein the breathable membrane allows diffusion of oxygen but keeps water from penetrating the disposable patch device to a certain depth and for a certain duration; and

a bottom layer coupled to the sub-assembly layer; and monitoring health of a user using the wearable device.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Jul 5, 2024
From: INNOVATUS LIFE SCIENCES LENDING FUND I, LP
To: VITAL CONNECT, INC.
Reel/Frame 068146/0132 →
SECURITY INTEREST Recorded Jul 5, 2024
From: VITAL CONNECT, INC.
To: TRINITY CAPITAL INC.
Reel/Frame 068146/0160 →
SECURITY INTEREST Recorded Jan 8, 2021
From: VITAL CONNECT, INC.
To: INNOVATUS LIFE SCIENCES LENDING FUND I, LP
Reel/Frame 054941/0651 →
RELEASE OF SECURITY INTEREST Recorded Jan 8, 2021
From: OXFORD FINANCE LLC
To: VITAL CONNECT, INC.
Reel/Frame 054941/0743 →
SECURITY INTEREST Recorded Apr 9, 2020
From: VITAL CONNECT, INC.
To: OXFORD FINANCE LLC
Reel/Frame 052354/0752 →
RELEASE OF SECURITY INTEREST Recorded Oct 5, 2017
From: PERCEPTIVE CREDIT OPPORTUNITIES FUND, L.P.; PERCEPTIVE CREDIT OPPORTUNITIES GP, LLC
To: VITAL CONNECT, INC.
Reel/Frame 043797/0083 →
PATENT SECURITY AGREEMENT Recorded Jun 10, 2016
From: VITAL CONNECT, INC.
To: PERCEPTIVE CREDIT OPPORTUNITIES FUND, LP; PERCEPTIVE CREDIT OPPORTUNITIES GP, LLC
Reel/Frame 039012/0547 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2014
From: ZADIG, STEPHEN
To: VITAL CONNECT, INC.
Reel/Frame 032409/0178 →
Continuity (2)
Provisional Application 61777900 · Mar 12, 2013
Related Publication 20140275932A1 · Sep 18, 2014
Cited By (9)
US 1,072,837 US 1,119,639 US 1,124,917 US 12,245,862 US 12,364,403 US 12,521,021 US 12,521,039 US 12,642,472 US 12,714,509