IP Library Granted Patent US 9,040,954
Granted Patent B2
US 9,040,954 · App. 14/207,236 · Granted May 26, 2015

Semiconductor light emitting device and method for manufacturing the same

Inventors: Tae Yun Kim (Gwangju, KR); Hyo Kun Son (Gwangju, KR)
Assignee: LG INNOTEK CO., LTD.
H01L33/06H01L33/04H01L33/08H01L33/007H01L21/02584H01L33/325H01L33/32
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Quick Facts
Patent No.
US 9,040,954
App. No.
14/207,236
Granted
May 26, 2015
Kind
B2
Abstract

A semiconductor light emitting device includes a first nitride semiconductor layer, a dopant doped semiconductor layer on the first nitride semiconductor layer, an active layer on the dopant doped semiconductor layer, a delta doped layer on the active layer, a superlattice structure on the delta doped layer, an undoped layer on the superlattice layer, a second nitride semiconductor layer including a first n-type dopant, a third nitride semiconductor layer including a second n-type dopant, and a fourth nitride semiconductor layer including a third n-type dopant.

Claims (45)

1. A light emitting device comprising:

a first conductive type semiconductor layer;

a first delta doped layer on the first conductive type semiconductor layer;

a super lattice structure on the first delta doped layer;

an active layer on the super lattice layer;

a second conductive type cladding layer on the active layer; and

a second conductive type semiconductor layer on the second conductive type cladding layer,

wherein a ratio of a thickness of the super lattice structure to a thickness of the first delta doped layer is in a range of about 1 to 100.

2. The light emitting device according to claim 1 , wherein the first delta doped layer is formed at a thickness of 0.2 nm˜0.5 nm.

3. The light emitting device according to claim 1 , wherein the super lattice structure is formed at a thickness of 5 Ř200 Å.

4. The light emitting device according to claim 1 , wherein the first conductive type semiconductor layer is a n-type semiconductor layer.

5. The light emitting device according to claim 1 , wherein the first conductive type layer comprises a GaN layer.

6. The light emitting device according to claim 1 , wherein the active layer includes InGaN layer and GaN layer.

7. The light emitting device according to claim 1 , further comprising a dopant doped layer under the first conductive semiconductor layer.

8. The light emitting device according to claim 7 , wherein the dopant doped layer is an n-type semiconductor layer.

9. The light emitting device according to claim 1 , further comprising a third semiconductor layer on the second conductive type semiconductor layer,

wherein the third semiconductor layer is a n-type semiconductor layer.

10. The light emitting device according to claim 9 , wherein the third semiconductor layer has a composition formula of In x Al y Ga 1-x-y N (0≦x≦1, 0≦y≦1, 0≦x+y≦1).

11. The light emitting device according to claim 1 , wherein the first delta doped layer and the first conductive type semiconductor layer are doped with an n-type dopant.

12. A light emitting device comprising:

a first conductive type semiconductor layer comprising an AlGaN layer;

a first delta doped layer on the first conductive type semiconductor layer;

a super lattice structure on the first delta doped layer;

a second delta doped layer on the super lattice structure;

an active layer on the second delta doped layer;

a second conductive type cladding layer on the active layer; and

a second conductive type semiconductor layer on the second conductive type cladding layer,

wherein a ratio of a thickness of the super lattice structure to a thickness of the first delta doped layer is in a range of about 1 to 100.

13. The light emitting device according to claim 12 , wherein a ratio of the thickness of the super lattice structure to a thickness of the second delta doped layer is in a range of about 1 to 100.

14. The light emitting device according to claim 12 , further comprising a dopant doped layer under the first conductive type semiconductor layer.

15. The light emitting device according to claim 14 , wherein the dopant doped layer is an n-type semiconductor layer.

16. A light emitting device comprising:

a first conductive type semiconductor layer comprising an AlGaN layer;

a first delta doped layer on the first conductive type semiconductor layer;

a second delta doped layer on the first delta doped layer;

a super lattice structure on the first delta doped layer;

a third delta doped layer on the super lattice structure;

an active layer on a third delta doped layer;

a second conductive type cladding layer on the active layer; and

a second conductive type semiconductor layer on the second conductive type cladding layer,

wherein a ratio of a thickness of the super lattice structure to a thickness of the first delta doped layer is in a range of about 1 to 100.

17. The light emitting device according to claim 16 , wherein a ratio of the thickness of the super lattice structure to a thickness of the second delta doped layer is in a range of about 1 to 100.

18. The light emitting device according to claim 16 , wherein a ratio of the thickness of the super lattice structure to a thickness of the third delta doped layer is in a range of about 1 to 100.

19. The light emitting device according to claim 16 , further comprising a dopant doped layer under the first conductive type semiconductor layer.

20. The light emitting device according to claim 19 , wherein the dopant doped layer is an n-type semiconductor layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2007-0086711 · Aug 28, 2007 · national
Continuity (6)
Continuation 13864978 · Apr 17, 2013
Continuation 13453804 · Apr 23, 2012
Continuation 13004758 · Jan 11, 2011
Continuation 12659208 · Mar 1, 2010
Continuation 12198728 · Aug 26, 2008
Related Publication 20140191190A1 · Jul 10, 2014