Design-for-manufacturing—design-enabled-manufacturing (DFM-DEM) proactive integrated manufacturing flow

1. A method comprising:

using a computer for

receiving design data related to layout of an integrated circuit (IC);

extracting information from the design data;

performing analysis on the extracted information;

enabling design-for-manufacturing (DFM) and design-enabled-manufacturing (DEM) aware manufacturing (collectively DFM-DEM) applications using information stored in a knowledge database, wherein the knowledge database stores information related to DFM and DEM for facilitating DFM-DEM aware manufacturing; and

updating the knowledge database with new information learned from at least the extracted information and the analysis.

2. The method of claim 1 , wherein the extracted information include design attributes and features of interest.

3. The method of claim 1 , wherein the extracting information comprises extracting the information based on features profiling, pattern matching, simulations, lithography simulation, chemical-mechanical polishing (CMP) simulation, Critical Area Analysis (CAA) simulation, Manufacturing Analysis and Scoring (MAS) simulation, or any combination thereof.

4. The method of claim 1 , wherein the DEM aware manufacturing applications comprise process prediction, process recipe optimization, process control, monitoring, inline scan, scan diagnostic data analysis, metrology, failure analysis, design-technology co-optimization and DFM deck optimization.

5. The method of claim 4 , wherein process prediction comprises:

establishing patterns of previous products process result;

utilizing results of the establishing for fuzzy pattern matching with one or more new products;

classifying the one or more new products with one or more matched results;

performing layout profiling; and

utilizing information previously stored in the knowledge database for process prediction and control.

6. The method of claim 4 , wherein process recipe optimization comprises:

performing optical rule checking (ORC) simulation to detect hotspots;

generating a report on a result of the ORC simulation;

extracting and classifying one or more layout patterns;

updating a pattern database with results of the extracting and classifying; and

validating the hotspots and providing a feedback.

7. The method of claim 6 , further comprising:

updating the knowledge database with the report on the result of the ORC simulation and the results of the extracting and classifying.

8. The method of claim 1 , wherein the new information comprises one or more new pattern issues, one or more new masks, or a combination thereof.

9. The method of claim 1 , wherein the knowledge database stores information related to process sensitivity, design information including type of hotspots and width, location of pattern in mask, pattern type or identification, and mask simulation information.

10. The method of claim 9 , wherein the mask simulation information comprises simulated topography height, copper height and location, dielectric height and location, simulated contour of patterns and associated locations, simulated critical dimensions (CD) of width and space of the patterns, CAA score, simulated MAS score or a combination thereof.

11. The method of claim 9 , wherein the knowledge database further stores information comprising actual height of silicon topography, actual height of copper, actual height of dielectric, actual scanning electron microscope (SEM) silicon image clips of patterns, and actual CD of width and space of the patterns.

12. The method of claim 9 , wherein the knowledge database further stores information comprising one or more recommended rules and associated yield impact in design, wherein the one or more recommended rules are of categories including yield redundancy, yield marginality, yield variability, and yield critical area.

13. The method of claim 9 , wherein the knowledge database further stores information comprising pattern matching results and layout profiled results, wherein the pattern matching results comprise marginal or critical patterns which are detected from each design, and wherein the layout profiled results comprise one or more design feature of manufacturing interest.

14. The method of claim 1 , further comprising:

generating a report on one or more results from the extracting.

15. The method of claim 14 , wherein the performing analysis on the extracted information comprises matching information in the report to information stored in the knowledge database.

16. The method of claim 1 , further comprising:

correlating information stored in the knowledge database with existing silicon data.

17. The method of claim 1 , further comprising:

receiving tape-out of a semiconductor chip design;

performing data preparation and lithography verification and simulation to detect one or more hotspots;

performing pattern analysis by utilizing pattern database, which is a feature of the knowledge database, to classify at least one of the one or more hotspots; and

updating a pattern library associated with the pattern database.

18. The method of claim 17 , further comprising:

classifying each of the at least one of the one or more hotspots as a known critical pattern, a known non-critical pattern, an unknown critical pattern, or an unknown non-critical pattern; and

adding the unknown critical patterns to the pattern library.

19. The method of claim 17 , further comprising:

triggering DFM design kits update in the knowledge database based at least in part on the classified at least one of the one or more hotspots.

20. The method of claim 17 , further comprising:

triggering DEM manufacturing activities comprising in-line monitoring, process change by the classified at least one of the one or more hotspots, validating the classified at least one of the one or more hotspots through manufacturing, or a combination thereof.

21. A system comprising:

a processing unit; and

a memory, wherein the memory comprises a program module configured to

receive design data related to layout of an integrated circuit (IC),

extract information from the design data,

perform analysis on the extracted information,

enable design-for-manufacturing (DFM) and design-enabled-manufacturing (DEM) aware manufacturing (collectively DFM-DEM) applications using information stored in a knowledge database, and

update the knowledge database with new information learned from at least the extracted information and the analysis.