Laser systems and methods for AOD tool settling for AOD travel reduction
View Patent ↗Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration.
1. A method of processing a workpiece by operation of a laser tool, the laser tool defining a beam axis along which a laser beam propagates, the method comprising:
causing relative movement, at a first velocity, between the beam axis and a surface of the workpiece to direct the beam axis toward a first target location of the workpiece;
upon arriving at or near the first target location, changing the velocity of the relative movement from the first velocity to a second velocity;
in response to the change to the second velocity, initiating a first settle period to delay emission of a laser pulse so that a start of the laser pulse is incident at the first target location after completion of the first settle period;
upon completion of the emission of the laser pulse incident at the first target location, initiating a second settle period; and
after completion of the second settle period, changing from the second velocity to a third velocity to cause relative movement, at the third velocity, between the beam axis and the surface of the workpiece to direct the beam axis from the first target location toward a second target location of the workpiece.
2. The method of claim 1 , wherein causing the relative movement between the beam axis and the surface of the workpiece comprises:
imparting, using a first positioning system, a first portion of the relative movement between the beam axis and the surface of the workpiece; and
imparting, using a second positioning system, a second portion of the relative movement between the beam axis and the surface of the workpiece, the second portion of the relative movement superimposed on the first portion of relative movement.
3. The method of claim 2 , wherein the second positioning system comprises at least one deflection device selected from the group consisting of: an acousto-optic deflector (AOD), an acousto-optic modulator (AOM), an electro-optic deflector (EOD), an electro-optic modulator (EOM), and a fast steering mirror (FSM), wherein the method further comprises determining the transient response based on a tertiary filter configured to provide the position commands to the at least one deflection device.
4. The method of claim 1 , wherein the first velocity is greater than the second velocity.
5. The method of claim 1 , wherein the third velocity is different than the first velocity.
6. The method of claim 1 , wherein the second velocity is zero so that the beam axis dwells at the first target location while at least a portion of the laser pulse is incident thereon.
7. The method of claim 1 , further comprising:
selecting the second velocity based on a tooling velocity at the first target location, the tooling velocity corresponding to a circular tooling trajectory at the first target location; and
during the first settle period, and before the start of the laser pulse is incident at the first target location, causing relative movement between the beam axis and the surface of the workpiece along the circular tool trajectory at the first target location.
8. The method of claim 7 , further comprising:
during the second settle period, and after completion of the end of the laser pulse incident at the first target location, continuing to cause the relative movement between the beam axis and the surface of the workpiece along the circular tool trajectory at the first target location.
9. The method of claim 1 , wherein changing from the first velocity to the second velocity or from the second velocity to the third velocity comprises a step change in velocity.
10. The method of claim 1 , wherein the third velocity is about equal to the first velocity.
11. The method of claim 1 , wherein the third velocity is greater than the second velocity.
12. The method of claim 1 , wherein changing from the first velocity to the second velocity or from the second velocity to the third velocity comprises a velocity change selected from the group consisting of: a ramped change and a sine profiled change.
13. A laser processing apparatus to form or process features within one or more materials of a workpiece, the laser processing apparatus comprising:
a laser system to generate a beam of laser pulses;
a first beam positioning system to impart relative movement between a beam axis and a surface of the workpiece;
a second beam positioning system to impart relative movement between the beam axis and the surface of the workpiece;
a controller to coordinate the laser system with the relative movement imparted by the first beam positioning system and the second beam positioning system, the controller configured to:
delay the laser system from emitting the beam of laser pulses after the beam axis arrives at a target location relative to the surface of the workpiece; and
delay the first beam positioning system and the second beam positioning system from moving the beam axis away from the target location after the target location has been processed by the beam of laser pulses.
14. The laser processing apparatus of claim 13 , wherein the second beam positioning system comprises one or more deflection devices selected from a group comprising an acousto-optic deflector (AOD), an acousto-optic modulator (AOM), an electro-optic deflector (EOD), and an electro-optic modulator (EOM), and wherein the controller is further configured to determine the transient response based on a tertiary filter configured to provide the position commands to the one or more deflection devices.
15. The laser processing apparatus of claim 14 , wherein the controller is further configured to reduce a deflection range needed for the second beam positioning system to respond to a high-bandwidth position command by aligning, in time, a first peak value of the transient response with a first settle period before emitting the beam of laser pulses after the beam axis arrives at a target location and a second peak value of the transient response with a second settle period before moving the beam axis away from the target location after the target location has been processed.
16. The laser processing apparatus of claim 13 , wherein the controller is further configured to:
while delaying the laser system from emitting the beam of laser pulses after the beam axis arrives at a target location, impart circular motion to the beam axis, the circular motion corresponding to a hole to be processed at the target location.
17. The laser processing apparatus of claim 13 , wherein the controller is further configured to:
while delaying the first beam positioning system and the second beam positioning system from moving the beam axis away from the target location after the target location has been processed by the beam of laser pulses, impart circular motion to the beam axis, the circular motion corresponding to a hole that was processed at the target location.
18. A method of processing a workpiece by operation of a laser tool, the laser tool defining a beam axis along which a laser beam propagates, the method comprising:
causing relative movement, at a first velocity, between the beam axis and a surface of the workpiece to direct the beam axis toward a first target location of the workpiece;
upon arriving at or near the first target location, changing from a first velocity to a second velocity;
in response to the change to the second velocity, initiating a first settle period to delay emission of a laser pulse so that a start of the laser pulse is incident at the first target location after completion of the first settle period;
upon completion of the emission of the laser pulse incident at the first target location, initiating a second settle period;
after completion of the second settle period, changing from the second velocity to a third velocity to cause relative movement, at the third velocity, between the beam axis and the surface of the workpiece to direct the beam axis from the first target location toward a second target location of the workpiece; and
reducing a deflection range needed for responding to a high-bandwidth position command by aligning, in time, a first peak value of a transient response of the second positioning system to position commands with the first settle period before the start of the laser pulse is incident at the first target location and a second peak value of the transient response with the second settle period before changing from the second velocity to the third velocity.