Thin film transistor array panel and manufacturing method thereof
A thin film transistor array panel includes an insulation substrate; a gate line and a data line on the insulation substrate; a first passivation layer on the gate line and the data line; an organic layer on the first passivation layer; a first electrode on the organic layer; a second passivation layer on the first electrode; and a second electrode on the second passivation layer. An edge of the organic layer is exposed by the first electrode.
1. A thin film transistor array panel, comprising:
an insulation substrate;
a gate line and a data line on the insulation substrate;
a first passivation layer on the gate line and the data line;
an organic layer on the first passivation layer;
a first electrode on the organic layer;
a second electrode connected to a thin film transistor via a contact hole defined in the organic layer; and
a second passivation layer between the first electrode and the second electrode which is connected to the thin film transistor via the contact hole defined in the organic layer,
wherein
an edge of the organic layer is exposed by the first electrode at the contact hole via which the second electrode is connected to the thin film transistor,
the second passivation layer is extended to define a first portion thereof at the exposed edge of the organic layer, the first portion of the second passivation layer disposed between the second electrode and the organic layer, and
the first portion of the second passivation layer extends to be disposed inside the contact hole via which the second electrode is connected to the thin film transistor.
2. The thin film transistor array panel of claim 1 , wherein:
the gate line comprises a gate pad portion at a distal end thereof, and
the data line comprises a data pad portion at a distal end thereof,
further comprising a blocking member on the organic layer, wherein the blocking member on the organic layer is at a peripheral region of the gate pad portion and at a peripheral region of the data pad portion.
3. The thin film transistor array panel of claim 2 , wherein:
the blocking member is in a same layer as the first electrode.
4. The thin film transistor array panel of claim 3 , wherein:
the blocking member at the peripheral region of the gate pad portion and the data pad portion exposes an edge of the organic layer at the peripheral region of the gate pad portion and the data pad portion.
5. The thin film transistor array panel of claim 1 , wherein:
one of the first electrode and the second electrode has a planar shape, and the other of the first electrode and the second electrode comprises a branch electrode defined by an opening portion defined in the other electrode.
6. The thin film transistor array panel of claim 1 , further comprising:
a common voltage line in a same layer as the gate line or the data line,
wherein
an opening defined in the organic layer and the first electrode exposes a portion of the common voltage line, and
a contact hole defined in the second passivation layer exposes the first electrode, and
further comprising a connecting member covering the common voltage line exposed through the opening and the first electrode exposed through the contact hole.
7. The thin film transistor array panel of claim 6 , wherein:
the connecting member is spaced apart from the second electrode, and is in a same layer as the second electrode.
8. A thin film transistor array panel, comprising:
an insulation substrate;
a gate line and a data line on the insulation substrate;
a first passivation layer on the gate line and the data line;
an organic layer on the first passivation layer and in which a contact hole is defined, wherein a sidewall of the organic layer defines the contact hole in the organic layer;
a first electrode on the organic layer, the first electrode exposing an upper surface of the organic layer extended from the sidewall thereof;
a second passivation layer on the first electrode;
a second electrode on the second passivation layer, the second electrode connected to a thin film transistor via the contact hole defined in the organic layer; and
a third passivation layer between the second passivation layer and the organic layer, the third passivation layer disposed non-overlapping with the first electrode and covering a side surface of the first electrode at an edge thereof,
wherein
the second passivation layer overlaps the side surface and the edge of the first electrode in a plan view, and
edges of the second and third passivation layers at the contact hole via which the second electrode is connected to the thin film transistor each exposes the exposed upper surface of the organic layer extended from the sidewall thereof.
9. The thin film transistor array panel of claim 8 , wherein:
the first electrode exposes an edge of the second passivation layer.
10. The thin film transistor array panel of claim 9 , wherein:
the edges of the second and third passivation layers at the contact hole via which the second electrode is connected to the thin film transistor substantially coincide with each other, and
the coinciding edges of the second and third passivation layers at the contact hole expose the upper surface of the organic layer extended from the sidewall thereof.
11. The thin film transistor array panel of claim 10 , wherein:
the gate line comprises a gate pad portion at a distal end thereof, and
the data line comprises a data pad portion at a distal end thereof,
further comprising a blocking member on the organic layer, wherein the blocking member on the organic layer is at a peripheral region of the gate pad portion and at a peripheral portion of the data pad portion.
12. The thin film transistor array panel of claim 11 , wherein:
the blocking member is in a same layer as the first electrode.
13. The thin film transistor array panel of claim 12 , wherein:
the second passivation layer at the peripheral region of the gate pad portion and the data pad portion overlaps an edge of the blocking member at the peripheral region of the gate pad portion and the data pad portion.
14. The thin film transistor array panel of claim 13 , wherein:
the blocking member exposes an edge of the second passivation layer at the peripheral region of the gate pad portion and the data pad portion.
15. The thin film transistor array panel of claim 14 , wherein:
the third passivation layer covers a side surface at the edge of the blocking member at the peripheral region of the gate pad portion and the data pad portion, and
an edge of the third passivation layer at the peripheral region of the gate pad portion and the data pad portion substantially coincides with the edge of the second passivation layer at the peripheral region of the gate pad portion and the data pad portion.
16. The thin film transistor array panel of claim 8 , wherein:
one of the first electrode and the second electrode has a planar shape, and the other of the first electrode and the second electrode comprises a branch electrode defined by an opening portion defined in the other electrode.