IP Library Granted Patent US 9,245,712
Granted Patent B2
US 9,245,712 · App. 14/221,514 · Granted Jan 26, 2016

Focused ion beam system

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Quick Facts
Patent No.
US 9,245,712
App. No.
14/221,514
Granted
Jan 26, 2016
Kind
B2
Abstract

A focused ion beam system includes a gas field ion source which generates gas ions, an ion gun unit which accelerates the gas ions and radiates the gas ions as an ion beam, a beam optical system which includes at least a focusing lens electrode and radiates the ion beam onto a sample, and an image acquiring mechanism which acquires an FIM image of a tip of an emitter based on the ion beam. The image acquiring mechanism includes an alignment electrode which is disposed between the ion gun unit and the focusing lens electrode and adjusts a radiation direction of the ion beam, an alignment control unit which applies an alignment voltage to the alignment electrode, and an image processing unit which combines a plurality of FIM images acquired when applying different alignment voltages to generate one composite FIM image.

Claims (22)

1. A focused ion beam system comprising:

a gas field ion source which includes an emitter with a sharp tip, and is configured to ionize a gas at the tip of the emitter to generate gas ions;

an ion gun unit which is configured to accelerate the gas ions and radiate the gas ions as an ion beam while extracting the gas ions toward a sample;

a beam optical system which includes at least a focusing lens electrode, and is configured to radiate the ion beam onto the sample while focusing the ion beam; and

an image acquiring mechanism which is configured to acquire an FIM image of the tip of the emitter based on the ion beam,

wherein the image acquiring mechanism includes:

an alignment electrode which is disposed between the ion gun unit and the focusing lens electrode, and is configured to adjust a radiation direction of the ion beam;

an alignment control unit which is configured to apply an alignment voltage to the alignment electrode;

a storage unit which is configured to store the acquired FIM image; and

an image processing unit which is configured to perform image processing to combine a plurality of FIM images to generate one composite FIM image, wherein the plurality of FIM images are acquired when applying different alignment voltages and are stored in the storage unit.

2. The focused ion beam system according to claim 1 ,

wherein the image processing unit is configured to combine the plurality of FIM images based on patterns of bright points appearing in the FIM images.

3. The focused ion beam system according to claim 1 , further comprising:

a micro-channel plate which is disposed between the focusing lens electrode and the sample, and which is configured to be movable between a position located on a light path of the ion beam and a position deviated from the light path, and to receive the ion beam having passed through the focusing lens electrode to project the FIM image onto a fluorescent screen,

wherein the image acquiring mechanism is configured to acquire the FIM image projected on the fluorescent screen.

4. The focused ion beam system according to claim 3 ,

wherein the image acquiring mechanism is configured to acquire the FIM image in a state where applying of a voltage to the focusing lens electrode is stopped.

5. The focused ion beam system according to claim 1 , further comprising:

a deflector which is disposed between the focusing lens electrode and the sample, and which is configured to correct the radiation direction of the ion beam having passed through the focusing lens electrode, and to perform scanning with the corrected ion beam in a direction parallel to a surface of the sample; and

a deflection control unit which is configured to apply a correction signal to the deflector such that the deflector performs the correction, and to apply a scan signal to the deflector such that the deflector performs the scanning,

wherein the deflector is configured to perform the correction such that the radiation direction of the ion beam having passed through the focusing lens electrode becomes parallel to an axial line of the emitter, and

wherein the image acquiring mechanism is configured to acquire an FIM image based on the scan signal and a detection signal of secondary charged particles generated from the sample at incidence of the ion beam, or based on the scan signal and a detection signal of a beam current of the ion beam incident on the sample.

Assignments (3)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0636 →
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072909/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2014
From: SUGIYAMA, YASUHIKO; KOZAKAI, TOMOKAZU; MATSUDA, OSAMU
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 032497/0974 →