Stacked thin channels for boost and leakage improvement
View Patent ↗A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.
1. A memory device, comprising:
a hollow-channel pillar structure comprising a first end and a second end, the first end of the pillar structure being coupled to a source and the second end of the pillar structure being coupled to a bit line,
the pillar structure further comprising:
a thin channel surrounding a dielectric material, the thin channel comprising a first region and a second region,
the first region being located along the pillar structure in proximity to the source and the second region being located along the pillar structure distal from the source,
the first region of the thin channel comprising a first level of doping and the second region of the thin channel comprising a second level of doping, and
the second level of doping being different from the first level of doping.
2. The memory device according to claim 1 , wherein the first level of doping improves a strong current in the thin channel, and the second level of doping reduces leakage current in the thin channel.
3. The memory device according to claim 1 , wherein the thin channel comprises a polysilicon material.
4. The memory device according to claim 3 , wherein the first level of doping improves a strong current in the polysilicon material, and the second level of doping reduces leakage current in the polysilicon materials.
5. The memory device according to claim 4 , further comprising:
a select gate source (SGS) formed at the first end of the pillar structure; and
a select gate drain (SGD) formed at the second end of the pillar structure.
6. The memory device according to claim 5 , further comprising at least one non-volatile memory cell formed along the pillar structure between the SGS and the SGD.
7. The memory device according to claim 1 , wherein the memory device comprises part of a solid-state drive (SSD).
8. The memory device according to claim 1 , wherein the memory device comprises part of an array of memory devices.
9. A memory device, comprising:
a source layer;
a first hollow-channel pillar structure formed on the source layer, the first hollow-channel pillar structure comprising a first thin channel having a first level of doping; and
a second hollow-channel pillar structure formed on the first hollow-channel pillar structure, the second hollow-channel pillar structure comprising a second thin channel having a second level of doping, the second thin channel being in contact with the first thin channel, and the second level of doping being different from the first level of doping.
10. The memory device according to claim 9 , wherein the first level of doping improves a strong current in the first thin channel, and the second level of doping reduces leakage current in the second thin channel.
11. The memory device according to claim 9 , wherein the first and second thin channels comprise a polysilicon material.
12. The memory device according to claim 11 , wherein the first level of doping improves a strong current in the first thin channel, and the second level of doping reduces leakage current in the second thin channel.
13. The memory device according to claim 12 , further comprising:
a select gate source (SGS) formed along the first pillar structure; and
a select gate drain (SGD) formed along the second pillar structure.
14. The memory device according to claim 13 , further comprising at least one non-volatile memory cell formed along the first pillar structure, the second pillar structure, or a combination thereof, between the SGS and the SGD.
15. The memory device according to claim 9 , wherein the memory device comprises part of a solid-state drive (SSD).
16. The memory device according to claim 9 , wherein the memory device comprises part of an array of memory devices.