FLIP-CHIP WAFER LEVEL PACKAGE AND METHODS THEREOF
An electronic package includes a flip-chip component having a first die coupled to a flip-chip substrate, second die stacked on the first die, an encapsulation compound formed around the first die and the second die, a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate, and a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.
1 . A method for manufacturing an electronic package, the method comprising:
providing a flip-chip component having a first die coupled to a flip-chip substrate;
adhering the first die to a second die;
forming an encapsulation compound around the first die and the second die;
drilling a set of through encapsulant vias (TEVs) from a first side of the electronic package to the flip-chip substrate located on a second side of the electronic package;
filling the set of TEVs with an electrically conductive material; and
applying a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.
2 . The method of claim 1 further comprising applying a protection layer covering the redistribution layer and the TEVs.
3 . The method of claim 1 further comprising adhering solder balls to the flip-chip substrate.
4 . The method of claim 1 further comprising separately testing and burning-in the flip-chip component.
5 . The method of claim 1 further comprising:
adhering the second die to a mold carrier with a releasable adhesive; and
removing the mold carrier from the second die.
6 . The method of claim 1 further comprising:
adhering the flip-chip component to a mold carrier with a releasable adhesive; and
removing the mold carrier from the flip-chip component.
7 . The method of claim 6 further comprising coupling a set of posts onto the set of contacts on the second die.
8 . The method of claim 5 wherein the posts comprise copper.
9 . The method of claim 6 further comprising:
forming the encapsulation compound over the second die; and
exposing the posts.
10 . The method of claim 9 wherein exposing the posts comprises grinding the encapsulation compound until the posts are exposed, the encapsulation compound forming a substantially planer surface.
11 . The method of claim 9 wherein exposing the posts comprises laser drilling the encapsulation compound.